Flexible films having high dielectric constants with low dielectric loss have promising application in the emerging area of high‐energy‐density materials. Here, for the first time, an organometallic, Sn‐polyester‐containing hybrid free‐standing film in polyimide matrix is reported. Polyimide, pBTDA‐HDA, is used with poly(dimethyltin glutarate) and poly(dimethyltin‐3,3‐dimethyglutarate) (pDMTDMG) for having a processable film with tunable dielectric properties. Hybrid film with 60% pDMTDMG and 40% PI (HB2) is found to have improved dielectric features over previously synthesized organic polyimide and organometallic Sn‐polyester homopolymers. These novel organometallic–organic hybrid systems expanded a new area of dielectrics for next‐generation electronics with superior overall electrical performance.

中文翻译：

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锡-聚酯/聚酰亚胺混合柔性自立膜作为可调谐介电材料

具有高介电常数和低介电损耗的柔性薄膜在高能量密度材料的新兴领域中具有广阔的应用前景。在这里，首次报道了在聚酰亚胺基体中有机金属，含锡聚酯的杂化自立式薄膜。聚酰亚胺（pBTDA-HDA）与聚（戊二酸二甲基锡）和聚（二甲基锡-3,3-二甲基戊二酸）（pDMTDMG）一起使用，以形成具有可调介电性能的可加工膜。与先前合成的有机聚酰亚胺和有机金属锡聚酯均聚物相比，具有60％pDMTDMG和40％PI（HB2）的杂化膜具有改善的介电特性。这些新颖的有机金属-有机混合系统以优异的整体电气性能为下一代电子产品扩展了电介质的新领域。