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InGaN/GaN microdisks enabled by nanoporous GaN cladding
Optics Letters ( IF 3.1 ) Pub Date : 2018-11-12 , DOI: 10.1364/ol.43.005567 Ge Yuan , Cheng Zhang , Kanglin Xiong , Jung Han
Optics Letters ( IF 3.1 ) Pub Date : 2018-11-12 , DOI: 10.1364/ol.43.005567 Ge Yuan , Cheng Zhang , Kanglin Xiong , Jung Han
The fabrication of nanoporous (NP) GaN is proposed as a generic technique to create out-of-plane index guiding for nitride microcavities. Compared to the conventional undercut technique, the proposed technique forms uniformly a low-index NP-GaN layer beneath the entire microcavity. Therefore, it supports all cavity modes (with different cavity geometries), while the undercut technique only supports the modes that reside at the circumference of a circular microcavity. As a proof of concept, GaN microdisk cavities were fabricated with the NP-GaN as the bottom low-index medium. A cold cavity with was reported under continuous-wave pumping. Lasing was demonstrated with threshold optical pumping power for the microdisk and for the microdisk. A rate equation analysis was performed to estimate the spontaneous coupling factor , which was one order of magnitude higher than the previous report of a nitride microdisk laser with an InGaN quantum well active region. Therefore, NP GaN was proven to be a suitable replacement of the undercut technique for future nitride microcavities applications.
中文翻译:
纳米多孔GaN覆层实现的InGaN / GaN微盘
提出了纳米孔(NP)GaN的制造方法,以创建用于氮化物微腔的面外折射率引导的通用技术。与传统的底切技术相比,所提出的技术在整个微腔下方均匀地形成了低折射率的NP-GaN层。因此,它支持所有腔模式(具有不同的腔几何形状),而底切技术仅支持驻留在圆形微腔周围的模式。作为概念证明,以NP-GaN作为底部低折射率介质制造了GaN微盘腔。冷腔据报道是在连续波抽水下。通过阈值光泵浦功率演示了激光发射 为了 微型磁盘和 为了 微型磁盘。进行速率方程分析以估计自发耦合因子,比先前报道的具有InGaN量子阱有源区的氮化物微盘激光器高一个数量级。因此,对于未来的氮化物微腔应用,已证明NP GaN是底切技术的合适替代品。
更新日期:2018-11-16
中文翻译:
纳米多孔GaN覆层实现的InGaN / GaN微盘
提出了纳米孔(NP)GaN的制造方法,以创建用于氮化物微腔的面外折射率引导的通用技术。与传统的底切技术相比,所提出的技术在整个微腔下方均匀地形成了低折射率的NP-GaN层。因此,它支持所有腔模式(具有不同的腔几何形状),而底切技术仅支持驻留在圆形微腔周围的模式。作为概念证明,以NP-GaN作为底部低折射率介质制造了GaN微盘腔。冷腔据报道是在连续波抽水下。通过阈值光泵浦功率演示了激光发射 为了 微型磁盘和 为了 微型磁盘。进行速率方程分析以估计自发耦合因子,比先前报道的具有InGaN量子阱有源区的氮化物微盘激光器高一个数量级。因此,对于未来的氮化物微腔应用,已证明NP GaN是底切技术的合适替代品。