SiC-coated 3D C/SiC composites were successfully joined using SPS technology with a Ti-Si-C interlayer. The interface morphologies, phase composition, and mechanical properties of the joints were investigated in detail. By adjusting the joining temperature, the interlayer transitioned, in situ, from Ti-Si-C compounds to Ti₃SiC₂ grains without decomposition. Because of the plastic deformation behavior of Ti₃SiC₂ grains, the ability of the interlayer to inhibit crack propagation increased. For joints with different interlayer thickness, the distribution of thermal residual stress was calculated using finite element analysis, and the distribution was associated with the evolution of interlayer morphologies, which was eventually used to establish fracture models. Optimized bonding was achieved without erosion of carbon fibers and also without interfacial defects. Finally, a reliable joint with shear strength of 51 ± 3.0 MPa was obtained by precisely controlling the interlayer reaction and optimizing thermal residual stress.

使用SPS技术和Ti-Si-C中间层成功地将SiC涂层3D C / SiC复合材料连接起来。详细研究了接头的界面形态，相组成和机械性能。通过调节接合温度，中间层从Ti-Si-C化合物原位过渡到Ti ₃ SiC ₂晶粒而没有分解。由于Ti ₃ SiC ₂的塑性变形行为对于晶粒，中间层抑制裂纹扩展的能力增加。对于具有不同夹层厚度的接头，使用有限元分析来计算热残余应力的分布，并且该分布与夹层形态的演变有关，并最终用于建立断裂模型。在不腐蚀碳纤维且没有界面缺陷的情况下实现了优化的粘合。最后，通过精确控制层间反应并优化热残余应力，获得了抗剪强度为51±3.0 MPa的可靠接头。