Abstract The high-temperature short-time heating step was followed by the low-temperature isothermal solidification step to join IN-738LC superalloy. The shorter bonding time can be applied in comparison to the conventional transient liquid phase process. A dendritic-cell like initial interface was observed which is different from a planar interface of conventional TLP bonds. This led to non-uniform distribution of voids along the joint. By completion of the isothermal solidification, quantity and size of the voids were decreased. A homogenization heat treatment produced the microstructure similar to that of the base metal.

中文翻译：

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Inconel 738LC 的两步加热瞬态液相键合

摘要 在高温短时加热步骤之后是低温等温凝固步骤以连接 IN-738LC 高温合金。与传统的瞬态液相工艺相比，可以应用更短的键合时间。观察到树突状细胞状初始界面，这与传统 TLP 键的平面界面不同。这导致沿接头的空隙分布不均匀。随着等温凝固的完成，空隙的数量和尺寸都减少了。均质化热处理产生与母材相似的微观结构。