Abstract A novel form of abrasive-free polishing is described, using Ce film deposited on a polishing pad by vacuum evaporation. Polishing using metallic films other than Ce, such as Al and Cu, generates defects on the glass surface with almost negligible material removal rates (MRRs), whereas Ce film with deionized (DI) water achieves smooth, scratch-free surfaces with noticeable MRR. If DI water is not supplied to the pad, there is significant deterioration in polishing performance. MRR increases with greater thickness of Ce film, and extremely smooth surface with sub-nanometer roughness is achieved using Ce film of thickness 2.5 μm. Polishing performance is dependent on conditions such as pad rotation rate and polishing pressure. By adding potassium hydroxide (KOH) to the polishing solution, the MRR almost matches that obtained with conventional abrasive polishing, but achieves ultra-smooth surface finish (Ra: 0.388 nm). The polishing method presented here uses approximately 94% less Ce compared with conventional abrasive polishing, thereby dramatically reducing consumption of this valuable rare earth element.

中文翻译：

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使用 Ce 薄膜对玻璃进行无磨料表面处理

摘要 描述了一种新形式的无磨料抛光，使用真空蒸发沉积在抛光垫上的 Ce 膜。使用除 Ce 以外的金属薄膜（例如 Al 和 Cu）进行抛光会在玻璃表面产生缺陷，材料去除率 (MRR) 几乎可以忽略不计，而使用去离子 (DI) 水的 Ce 薄膜可实现光滑、无划痕的表面，并具有明显的 MRR。如果不向抛光垫供应去离子水，抛光性能会显着下降。MRR随着Ce膜厚度的增加而增加，使用厚度为2.5μm的Ce膜可实现亚纳米级粗糙度的极其光滑的表面。抛光性能取决于抛光垫转速和抛光压力等条件。通过在抛光液中加入氢氧化钾 (KOH)，MRR 几乎与传统研磨抛光获得的相同，但实现了超光滑的表面光洁度（Ra：0.388 nm）。与传统研磨抛光相比，此处介绍的抛光方法使用的 Ce 减少了约 94%，从而显着减少了这种宝贵的稀土元素的消耗。