Transfer printing is an emerging deterministic assembly technique for micro-fabrication and nano-fabrication, which enables the heterogeneous integration of classes of materials into desired functional layouts. It creates engineering opportunities in the area of flexible and stretchable inorganic electronics with equal performance to conventional wafer-based devices but the ability to be deformed like a rubber, where prefabricated inorganic semiconductor materials or devices on the donor wafer are required to be transfer-printed onto unconventional flexible substrates. This paper provides a brief review of recent advances on transfer printing techniques for flexible and stretchable inorganic electronics. The basic concept for each transfer printing technique is overviewed. The performances of these transfer printing techniques are summarized and compared followed by the discussions of perspectives and challenges for future developments and applications.

转移印刷是一种用于微制造和纳米制造的新兴确定性组装技术，该技术使材料类别可以异构集成到所需的功能布局中。它在柔性和可拉伸的无机电子学领域创造了工程机遇，其性能与传统的基于晶圆的设备相同，但具有像橡胶一样的变形能力，在该领域，需要转移印刷施主晶圆上的预制无机半导体材料或器件到非常规的柔性基材上。本文简要回顾了柔性和可拉伸无机电子产品转移印刷技术的最新进展。概述了每种转移印刷技术的基本概念。