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Local Electrodeposition of Metals by Tip Electrode Dissolution Using Scanning Electrochemical Microscopy
Electroanalysis ( IF 3 ) Pub Date : 2018-09-20 , DOI: 10.1002/elan.201800515
Ara Jo 1 , Youngmi Lee 1 , Chongmok Lee 1
Affiliation  

We have electrodeposited palladium and gold micropatternings using scanning electrochemical microscopy (SECM) with the metal precursor ions generated via anodic dissolution of the ultramicroelectrode (UME) tip itself. Concurrently, in‐situ reduction of the metal ions occurred at the substrate electrode, where the deposition parameters were optimized. In particular, this is the first direct Pd patterning using Pd dissolution without any mediators. The catalytic activities of oxygen reduction on the Pd or Au were studied with tip generation‐substrate collection mode of SECM. The possibility of simultaneous co‐deposition of Pd and Au was also demonstrated using a dual Pd and Au UME.

中文翻译:

使用扫描电化学显微镜通过尖端电极溶解对金属进行局部电沉积

我们已经使用扫描电化学显微镜(SECM)电镀了钯和金的微图案,并通过超微电极(UME)尖端本身的阳极溶解生成了金属前驱体离子。同时,金属离子原位还原发生在基板电极上,在该电极处沉积参数得到了优化。特别是,这是使用Pd溶解而没有任何介体的第一个直接Pd图案化。利用SECM的尖端生成-底物收集模式研究了氧还原对Pd或Au的催化活性。Pd和Au双重UME也证明了同时共沉积Pd和Au的可能性。
更新日期:2018-09-20
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