Abstract The metallic Ni–5 at.%W (Ni5W) substrate with sharp cube texture is found as one of the promising candidates used for fabrication of coated conductors. However, the alternating current (AC) loss, partly contributed by the ferromagnetic Ni5W substrate is unavoidable. In this work, we analyzed the evolution of magnetic properties of Ni5W substrates via the cube texture development. The results revealed that the cube texture has an important impact related to size advantage during recrystallization, leading towards the consumption of the deformation and other orientational grains, and hence giving rise to form a sharp cube texture. Increasing the annealing temperature, the grain size is found to be increased. In the fully developed cube-textured substrate, the grain boundary was replaced by small angle grain boundaries (SAGBs). Also the magnetic domain structure was transformed from 180°-structure to a branched one with the increasing annealing temperature. This transformation is dependent on the increase of grain size, particularly, the SAGBs plays an important role in the formation of perfect domain structure. Increased coercivity and hysteresis loss in the fully textured substrate can be attributed towards the ideal cube texture and perfect complex domain structure. Therefore, a potential solution has been proposed to resolve this limitation of the sharp cube texture and increased hysteresis loss in Ni5W substrates.

中文翻译：

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立方织构发展对Ni-5at.%W合金基体磁性能的影响

摘要 具有尖锐立方体纹理的金属 Ni-5 at.%W (Ni5W) 基材被发现是用于制造涂层导体的有前途的候选材料之一。然而，部分由铁磁 Ni5W 基板造成的交流 (AC) 损耗是不可避免的。在这项工作中，我们通过立方体纹理发展分析了 Ni5W 基板的磁性演变。结果表明，立方织构对再结晶过程中的尺寸优势具有重要影响，导致变形和其他取向晶粒的消耗，从而形成尖锐的立方织构。提高退火温度，发现晶粒尺寸增加。在完全发展的立方体纹理基板中，晶界被小角晶界（SAGB）取代。随着退火温度的升高，磁畴结构也从180°结构转变为分支结构。这种转变依赖于晶粒尺寸的增加，特别是SAGBs在完美畴结构的形成中起着重要作用。在完全纹理化的基底中增加的矫顽力和磁滞损耗可归因于理想的立方体纹理和完美的复杂域结构。因此，已经提出了一种潜在的解决方案来解决 Ni5W 基板中尖锐立方体纹理和增加的滞后损耗的这种限制。SAGBs 在形成完美的域结构中起着重要作用。在完全纹理化的基底中增加的矫顽力和磁滞损耗可归因于理想的立方体纹理和完美的复杂域结构。因此，已经提出了一种潜在的解决方案来解决 Ni5W 基板中尖锐立方体纹理和增加的滞后损耗的这种限制。SAGBs 在形成完美的域结构中起着重要作用。在完全纹理化的基底中增加的矫顽力和磁滞损耗可归因于理想的立方体纹理和完美的复杂域结构。因此，已经提出了一种潜在的解决方案来解决 Ni5W 基板中尖锐立方体纹理和增加的滞后损耗的这种限制。