Abstract Poly(arylene ether ketone) containing naphthalene and phenolic hydroxyl groups (HPAEK) was prepared by polycondensation and demethylation reaction. Polymer cured epoxy resin with high-Tg was obtained through reactions between oxirane ring of epoxy and phenolic hydroxyl groups of HPAEK. Electrospinning technology was used to fabricate porous film. The porous film shows a high Tg value (262 °C), a low dielectric constant (1.9 at 1 MHz), and a low coefficient of thermal expansion (52 ppm °C−1). The thermal stability and water contact angle were also measured. The naphthalene and phenolic hydroxyl containing poly(arylene ether ketone) provides us with a new strategy to achieve ultralow dielectric constant materials via electrospinning.

中文翻译：

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含酚羟基的聚亚芳基醚酮固化超低介电纤维状环氧树脂热固性材料的制备与表征

摘要 通过缩聚和去甲基化反应制备了含有萘酚羟基的聚亚芳基醚酮(HPAEK)。通过环氧树脂的环氧乙烷环与HPAEK的酚羟基反应得到高Tg的聚合物固化环氧树脂。静电纺丝技术用于制造多孔薄膜。多孔膜显示出高 Tg 值 (262 °C)、低介电常数 (1.9 at 1 MHz) 和低热膨胀系数 (52 ppm °C-1)。还测量了热稳定性和水接触角。含有萘和酚羟基的聚（亚芳基醚酮）为我们提供了一种通过静电纺丝实现超低介电常数材料的新策略。