Abstract Layer structured high-performance thermal management materials via integrating the advantages of boron nitride (BN, electrically insulating) and graphene nanoplatelets (GNPs, highly thermally conductive) as fillers were realized by a facile and scalable strategy. Outstanding thermal conductivity (TC) of 8.45 W m−1 K−1, the highest value among reported electrically insulating polymer-based materials, excellent electrical insulation (breakdown voltage∼5.33 kV/mm; volume resistance ∼ 10 12 Ω c m ) and superior electromagnetic interface shielding performance are achieved at a filler loading of 17.88 vol%. Moreover, the mechanical properties and hardness are also in quite good range. Thus, a promising method is provided for large scale production of superior thermal management materials.

中文翻译：

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具有增强的导热性和击穿电压的电绝缘层结构 SiR/GNPs/BN 热管理材料

摘要 通过整合氮化硼（BN，电绝缘）和石墨烯纳米片（GNP，高导热）作为填料的优势，通过一种简便且可扩展的策略实现了层状结构的高性能热管理材料。出色的热导率 (TC) 为 8.45 W m-1 K-1，是已报道的基于聚合物的电绝缘材料中的最高值，具有出色的电绝缘性（击穿电压 ~5.33 kV/mm；体积电阻 ~ 10 12 Ω cm ）和卓越的在填充量为 17.88 vol% 时实现了电磁界面屏蔽性能。此外，机械性能和硬度也在相当好的范围内。因此，为大规模生产优良的热管理材料提供了一种有前途的方法。