Fabrication of 3D conductive circuits: print quality evaluation of a direct ink writing process,RSC Advances

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Fabrication of 3D conductive circuits: print quality evaluation of a direct ink writing process
RSC Advances ( IF 3.9 ) Pub Date : 2018-07-19 00:00:00 , DOI: 10.1039/c8ra03380c
F Tricot ₁ , C Venet ₂ , D Beneventi ₁ , D Curtil ₁ , D Chaussy ₁ , T P Vuong ₃ , J E Broquin ₃ , N Reverdy-Bruas ₁

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The use of conductive inks and direct writing techniques for the fabrication of electronic circuits on complex substrates is attracting ever increasing interest. However, the existing knowledge is only focused on the electrical performances of the produced smart objects with no direct correlation with the conductive paths morphology and printing conditions. In order to evaluate the printing quality of a direct writing process using an eccentric screw dispenser, a printing device for the deposition of silver paste on 3D objects was developed. Lines of different widths were printed on flat PC + ABS substrates by means of the developed printing device and a conventional screen printing process. The developed process permitted printing lines as thin as possible with screen printing but with a better regularity of their edges. However unlike screen printed lines, the thickness of the lines was dependent on their width. Finally, the possibility to print on 3D objects was demonstrated.

中文翻译：

3D导电电路的制造：直接墨水书写过程的打印质量评估

使用导电油墨和直接书写技术在复杂基板上制造电子电路引起了越来越多的兴趣。然而，现有的知识只集中在所生产的智能对象的电性能上，与导电路径形态和印刷条件没有直接关系。为了评估使用偏心螺旋分配器的直接书写过程的打印质量，开发了一种用于在 3D 物体上沉积银浆的打印设备。通过开发的印刷设备和传统的丝网印刷工艺，在平面 PC + ABS 基板上印刷了不同宽度的线条。所开发的工艺允许丝网印刷的印刷线尽可能薄，但边缘的规则性更好。然而，与丝网印刷线不同的是，线的粗细取决于它们的宽度。最后，展示了在 3D 对象上打印的可能性。

更新日期：2018-07-19

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