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Fabrication of Polyamide 6 Nanocomposite with Improved Thermal Conductivity and Mechanical Properties via Incorporation of Low Graphene Content
Industrial & Engineering Chemistry Research ( IF 3.8 ) Pub Date : 2018-08-02 , DOI: 10.1021/acs.iecr.8b01070
Rui Wang 1, 2 , Lixin Wu 1 , Dongxian Zhuo 3 , Jianhua Zhang 4 , Youdan Zheng 1, 2
Affiliation  

A 3D graphene network was constructed in polyamide 6 (PA6) monomers through the reduction and self-assembly of graphene oxide (GO), and then PA6 nanocomposites with low graphene content were fabricated through in situ polymerization. The effects of the 3D graphene network on the structure and properties of the PA6 were systematically investigated. Results show that the 3D graphene network can significantly improve the thermal conductivity of PA6. In the case of the PA6 with only 0.25 wt % graphene, its thermal conductivity is 0.69 W/(m K), about 2.88 times of that of the pure PA6. This improvement is attributed to the more-compact thermal conductive paths of the 3D graphene network, and its stronger interfacial interaction with PA6 in this work compares with those of pre-synthesized free-standing 3D graphene networks. Moreover, the mechanical properties and water resistance of PA6 also have significantly improved with the incorporation of the 3D graphene network.

中文翻译:

通过掺入低石墨烯含量制备具有改善的导热性和机械性能的聚酰胺6纳米复合材料

通过氧化石墨烯(GO)的还原和自组装,在聚酰胺6(PA6)单体中构建了3D石墨烯网络,然后通过原位聚合制备了石墨烯含量低的PA6纳米复合材料。系统地研究了3D石墨烯网络对PA6的结构和性能的影响。结果表明3D石墨烯网络可以显着提高PA6的导热率。在仅具有0.25wt%石墨烯的PA6的情况下,其导热率是0.69W /(m·K),约为纯PA6的导热率的2.88倍。这种改进归因于3D石墨烯网络的导热路径更紧凑,并且与预先合成的自立式3D石墨烯网络相比,在这项工作中与PA6的界面相互作用更强。而且,
更新日期:2018-08-02
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