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Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites†
RSC Advances ( IF 3.9 ) Pub Date : 2018-07-18 00:00:00 , DOI: 10.1039/c8ra04700f Cuiping Yu 1, 2, 3 , Wenbin Gong 2 , Jun Zhang 2 , Weibang Lv 2 , Wei Tian 1 , Xiaodong Fan 1 , Yagang Yao 2, 3
RSC Advances ( IF 3.9 ) Pub Date : 2018-07-18 00:00:00 , DOI: 10.1039/c8ra04700f Cuiping Yu 1, 2, 3 , Wenbin Gong 2 , Jun Zhang 2 , Weibang Lv 2 , Wei Tian 1 , Xiaodong Fan 1 , Yagang Yao 2, 3
Affiliation
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Styrene–ethylene–butylene–styrene (SEBS) composite films containing well-dispersed and highly aligned hexagonal boron nitride (hBN) platelets were achieved by a ball milling process followed by hot-pressing treatment. An ultrahigh in-plane thermal conductivity of 45 W m−1 K−1 was achievable in the SEBS composite film with 95 wt% hBN. The corresponding out-of-plane thermal conductivity was also as high as 4.4 W m−1 K−1. The hBN/SEBS composite film was further used to cool a CPU connected to a computer, resulting in a decrease by about 4 °C in the stable temperature. Percolation thresholds over 40 wt% and 60 wt% in the hBN/SEBS composites were obtained in the in-plane and out-of-plane directions, respectively. This phenomenon has rarely been reported in polymer composites. Molecular dynamics simulations were also conducted to support this percolation threshold. The linear coefficients of the thermal expansion value of the hBN/SEBS composite with 95 wt% hBN was as low as 16 ppm K−1. This was a significant decrease compared to that of pure SEBS (149 ppm K−1). The proposed strategy provides valuable advice about the heat-transfer mechanism in polymer composites containing oriented two-dimensional materials.
中文翻译：
SEBS弹性体中六方氮化硼的热压诱导排列，用于优质导热复合材料†
苯乙烯 - 乙烯 - 丁烯 - 苯乙烯 (SEBS) 复合薄膜含有分散良好和高度排列的六方氮化硼 (hBN) 薄片，通过球磨工艺和热压处理获得。在具有 95 wt% hBN 的 SEBS 复合膜中可实现45 W m -1 K -1的超高面内热导率。相应的面外热导率也高达 4.4 W m -1 K -1. hBN/SEBS复合膜进一步用于冷却连接到计算机的CPU，导致稳定温度下降约4°C。分别在面内和面外方向上获得了 hBN/SEBS 复合材料中超过 40 wt% 和 60 wt% 的渗透阈值。这种现象在聚合物复合材料中很少报道。还进行了分子动力学模拟以支持该渗透阈值。具有95 wt% hBN的hBN/SEBS复合材料的热膨胀值的线性系数低至16 ppm K -1。与纯 SEBS（149 ppm K -1）。所提出的策略为含有定向二维材料的聚合物复合材料的传热机制提供了有价值的建议。
更新日期：2018-07-18
中文翻译：
SEBS弹性体中六方氮化硼的热压诱导排列，用于优质导热复合材料†
苯乙烯 - 乙烯 - 丁烯 - 苯乙烯 (SEBS) 复合薄膜含有分散良好和高度排列的六方氮化硼 (hBN) 薄片，通过球磨工艺和热压处理获得。在具有 95 wt% hBN 的 SEBS 复合膜中可实现45 W m -1 K -1的超高面内热导率。相应的面外热导率也高达 4.4 W m -1 K -1. hBN/SEBS复合膜进一步用于冷却连接到计算机的CPU，导致稳定温度下降约4°C。分别在面内和面外方向上获得了 hBN/SEBS 复合材料中超过 40 wt% 和 60 wt% 的渗透阈值。这种现象在聚合物复合材料中很少报道。还进行了分子动力学模拟以支持该渗透阈值。具有95 wt% hBN的hBN/SEBS复合材料的热膨胀值的线性系数低至16 ppm K -1。与纯 SEBS（149 ppm K -1）。所提出的策略为含有定向二维材料的聚合物复合材料的传热机制提供了有价值的建议。
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