Abstract This study characterizes the Cu-Sn-Zn electrodeposits produced potentiostatically from baths containing different concentrations of Cu2+, Sn2+ and Zn2+ ions and 0.60 M trisodium nitrilotriacetic (NTA) at pH 4.99 (higher stability). Ternary electrodeposits were produced onto AISI 1010 steel substrate at electrodeposition potential of −1.60 V with electrodeposition charge density of 3.0 Ccm−2. Chemical composition of electrodeposits varied significantly, presenting higher Cu content (at.%) than that of other elements. Furthermore, it was verified that the high concentration of Sn2+ ions in the baths hindered the reduction of Zn2+ ions, leading to Zn-poor electrodeposits. Microstructure was generally composed of irregular crystallites and clusters of crystallites or dendrites dispersed on the surface, depending on chemical composition. X-ray diffraction showed formation of the ternary alloy by mixture of the Cu5Zn8, η-Cu6Sn5 and Sn pure phases. In addition, electrodeposits with lower Cu content (at.%) also showed the SnO phase. Surface topography of the electrodeposits presented a rough aspect, with arithmetic roughness varying from 1.83 to 3.90 μm for electrodeposits with lower and higher Sn content (at.%), respectively. Adhesion tests indicated that the highest and lowest adherence percentages to the steel substrate were observed for the electrodeposits with the largest Zn and Sn contents (at.%), respectively.

中文翻译：

---

基于次氮基三乙酸三钠的酸浴恒电位产生的 Cu-Sn-Zn 电沉积物的微观结构表征

摘要 本研究表征了从含有不同浓度的 Cu2+、Sn2+ 和 Zn2+ 离子和 0.60 M 次氮基三乙酸三钠 (NTA) 的镀液恒电位产生的 Cu-Sn-Zn 电沉积物，pH 值为 4.99（更高的稳定性）。三元电沉积在 AISI 1010 钢基材上产生，电沉积电位为 -1.60 V，电沉积电荷密度为 3.0 Ccm-2。电沉积物的化学成分变化很大，呈现出比其他元素更高的 Cu 含量 (at.%)。此外，经证实，镀液中高浓度的 Sn2+ 离子阻碍了 Zn2+ 离子的还原，导致电沉积物贫锌。微观结构通常由不规则的微晶和分散在表面的微晶或枝晶簇组成，这取决于化学成分。X 射线衍射表明由 Cu5Zn8、η-Cu6Sn5 和 Sn 纯相的混合物形成了三元合金。此外，具有较低铜含量 (at.%) 的电沉积物也显示出 SnO 相。电沉积物的表面形貌呈现出粗糙的外观，对于具有较低和较高 Sn 含量 (at.%) 的电沉积物，算术粗糙度分别从 1.83 到 3.90 μm 不等。附着力测试表明，对于分别具有最大 Zn 和 Sn 含量 (at.%) 的电沉积物，观察到对钢基材的最高和最低附着百分比。对于具有较低和较高 Sn 含量 (at.%) 的电沉积物，算术粗糙度分别从 1.83 到 3.90 μm 不等。附着力测试表明，对于分别具有最大 Zn 和 Sn 含量 (at.%) 的电沉积物，观察到对钢基材的最高和最低附着百分比。对于具有较低和较高 Sn 含量 (at.%) 的电沉积物，算术粗糙度分别从 1.83 到 3.90 μm 不等。附着力测试表明，对于分别具有最大 Zn 和 Sn 含量 (at.%) 的电沉积物，观察到对钢基材的最高和最低附着百分比。