The microstructure of printed Cu wirings fabricated from air‐stable Cu complex inks is greatly modified by low‐temperature curing followed by intense pulsed light densification enhancement treatment. The resulting almost full densification of printed Cu wirings enables them to possess a high electrical conductivity of 50% bulk Cu. The dense structure also largely prevents the permeation of oxygen and water into the inner side of the Cu wirings, thereby improving their oxidation resistance and maintaining a stable resistance (R/R₀ < 1.5) even after 1000 h aging at 85 °C‐85% RH. In addition, the dense and robust structure can improve the resistance to crack generation and propagation in Cu wirings during the bending, so as to improve their flexibility. The relative resistance of Cu wirings can be kept below 1.2 after 1000 bending cycles. All the results indicate that these highly densified Cu wirings fabricated from air‐stable Cu complex inks can be used to replace the noble metallic Au and Ag wirings for practical application in flexible electronics.

中文翻译：

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由空气稳定的铜络合物油墨制成的高密度铜布线，具有高电导率，增强的抗氧化性和柔韧性

通过低温固化以及随后的强脉冲光致密化增强处理，极大地改变了由空气稳定的铜络合物油墨制成的印刷铜布线的微观结构。印刷的铜布线几乎完全致密化，从而使它们具有50％体积铜的高电导率。致密的结构还可以很大程度上防止氧气和水渗透到Cu布线的内侧，从而提高其抗氧化性并保持稳定的电阻（R / R ₀<1.5），即使在85°C至85％相对湿度下老化1000小时后。另外，致密且坚固的结构可以提高在弯曲过程中对铜布线中裂纹产生和传播的抵抗力，从而提高其挠性。经过1000次弯曲后，Cu布线的相对电阻可以保持在1.2以下。所有结果表明，这些由空气稳定的铜络合物油墨制成的高度致密的铜线可用于替代贵金属的金和银线，以用于柔性电子产品中。