Abstract This study aims to correlate the microstructure and Volta potential distribution of Ti-Cu welded bimetal to its corrosion initiation sites, using AFM-SKPFM, and SEM-EDS. Local melted zones with Ti-Cu intermetallic precipitates in weld interface and in Cu matrix showed different Volta potential values in comparison with those of Ti and Cu regions. SKPFM revealed that Cu region has a higher Volta potential than that of Ti region. AFM and microstructural images after immersion in corrosive media proved the presence of a galvanic cell. Corrosion mainly extends on Cu side due to the increasing growth of Ti passive film.

中文翻译：

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使用 AFM-SKPFM 研究固态焊接 Ti-Cu 双金属中表面伏打电位与电偶腐蚀起始点的相关性

摘要 本研究旨在使用 AFM-SKPFM 和 SEM-EDS 将 Ti-Cu 焊接双金属的微观结构和 Volta 电位分布与其腐蚀起始位置相关联。与 Ti 和 Cu 区域相比，焊缝界面和 Cu 基体中具有 Ti-Cu 金属间析出物的局部熔化区显示出不同的 Volta 电位值。SKPFM 显示，Cu 区域比 Ti 区域具有更高的 Volta 电位。浸入腐蚀性介质后的 AFM 和显微结构图像证明存在原电池。由于Ti钝化膜的生长增加，腐蚀主要在Cu侧延伸。