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Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
Small ( IF 13.0 ) Pub Date : 2018-06-21 , DOI: 10.1002/smll.201801346 Nan Wang 1 , Majid Kabiri Samani 1 , Hu Li 2 , Lan Dong 3 , Zhongwei Zhang 3 , Peng Su 1 , Shujing Chen 4 , Jie Chen 3 , Shirong Huang 4 , Guangjie Yuan 4 , Xiangfan Xu 3 , Baowen Li 5 , Klaus Leifer 2 , Lilei Ye 6 , Johan Liu 1, 4
Small ( IF 13.0 ) Pub Date : 2018-06-21 , DOI: 10.1002/smll.201801346 Nan Wang 1 , Majid Kabiri Samani 1 , Hu Li 2 , Lan Dong 3 , Zhongwei Zhang 3 , Peng Su 1 , Shujing Chen 4 , Jie Chen 3 , Shirong Huang 4 , Guangjie Yuan 4 , Xiangfan Xu 3 , Baowen Li 5 , Klaus Leifer 2 , Lilei Ye 6 , Johan Liu 1, 4
Affiliation
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Due to substantial phonon scattering induced by various structural defects, the in‐plane thermal conductivity (K) of graphene films (GFs) is still inferior to the commercial pyrolytic graphite sheet (PGS). Here, the problem is solved by engineering the structures of GFs in the aspects of grain size, film alignment, and thickness, and interlayer binding energy. The maximum K of GFs reaches to 3200 W m−1 K−1 and outperforms PGS by 60%. The superior K of GFs is strongly related to its large and intact grains, which are over four times larger than the best PGS. The large smooth features about 11 µm and good layer alignment of GFs also benefit on reducing phonon scattering induced by wrinkles/defects. In addition, the presence of substantial turbostratic‐stacking graphene is found up to 37% in thin GFs. The lacking of order in turbostratic‐stacking graphene leads to very weak interlayer binding energy, which can significantly decrease the phonon interfacial scattering. The GFs also demonstrate excellent flexibility and high tensile strength, which is about three times higher than PGS. Therefore, GFs with optimized structures and properties show great potentials in thermal management of form‐factor‐driven electronics and other high‐power‐driven systems.
中文翻译：
通过结构工程定制石墨烯薄膜的热性能和机械性能
由于各种结构缺陷引起的大量声子散射，石墨烯薄膜（GF）的面内导热系数（ K ）仍然不如商业热解石墨片（PGS）。在这里，通过在晶粒尺寸、薄膜排列、厚度以及层间结合能方面设计GF结构来解决这个问题。 GF的最大K值达到3200 W m -1 K -1 ，比PGS高出60%。 GF 的优异K与其大而完整的颗粒密切相关，颗粒比最好的 PGS 大四倍以上。约 11 µm 的大光滑特征和良好的 GF 层排列也有利于减少由皱纹/缺陷引起的声子散射。此外，薄 GF 中存在高达 37% 的大量乱层堆叠石墨烯。乱层堆叠石墨烯缺乏有序性导致层间结合能非常弱，这可以显着降低声子界面散射。 GF 还表现出优异的柔韧性和高拉伸强度，大约是 PGS 的三倍。因此，具有优化结构和性能的GF在形状因数驱动的电子设备和其他高功率驱动系统的热管理方面显示出巨大的潜力。
更新日期：2018-06-21
中文翻译：
通过结构工程定制石墨烯薄膜的热性能和机械性能
由于各种结构缺陷引起的大量声子散射，石墨烯薄膜（GF）的面内导热系数（ K ）仍然不如商业热解石墨片（PGS）。在这里，通过在晶粒尺寸、薄膜排列、厚度以及层间结合能方面设计GF结构来解决这个问题。 GF的最大K值达到3200 W m -1 K -1 ，比PGS高出60%。 GF 的优异K与其大而完整的颗粒密切相关，颗粒比最好的 PGS 大四倍以上。约 11 µm 的大光滑特征和良好的 GF 层排列也有利于减少由皱纹/缺陷引起的声子散射。此外，薄 GF 中存在高达 37% 的大量乱层堆叠石墨烯。乱层堆叠石墨烯缺乏有序性导致层间结合能非常弱，这可以显着降低声子界面散射。 GF 还表现出优异的柔韧性和高拉伸强度，大约是 PGS 的三倍。因此，具有优化结构和性能的GF在形状因数驱动的电子设备和其他高功率驱动系统的热管理方面显示出巨大的潜力。
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