Abstract In this paper, we investigated the characteristics of a structured copper (Cu) film deposited on the surface of an insulating epoxy glass (EG) substrate via a facile electroless plating process. The film produced by this method was found to be of high purity and has a homogeneous microstructure consisting of an assembly of numerous aggregates that vary in size from 1 to 5 µm depending on the electroless deposition time. The electrocatalytic activity of the prepared electrode was investigated for the electrooxidation of formaldehyde using cyclic voltammetry in 0.1 M NaOH solution. Results show that formaldehyde oxidation takes place at a low potential of −0.34 V with large anodic current densities.

中文翻译：

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在环氧玻璃基板上化学镀铜用于甲醛的电催化

摘要 在本文中，我们研究了通过简便的化学镀工艺沉积在绝缘环氧玻璃 (EG) 基板表面上的结构化铜 (Cu) 膜的特性。发现通过这种方法生产的薄膜纯度高，具有均匀的微观结构，由许多聚集体组成，根据化学沉积时间的不同，这些聚集体的尺寸从 1 到 5 微米不等。使用循环伏安法在 0.1 M NaOH 溶液中研究了制备的电极对甲醛电氧化的电催化活性。结果表明，甲醛氧化发生在-0.34 V 的低电位下，阳极电流密度大。