Abstract This paper presents the first micro-scale process for local deposition and direct writing of metal films through sputtering of a micromachined target electrode. The deposition process is achieved via a highly confined micro DC glow plasma generated between the electrode’s tip and the substrate at atmospheric pressure. Using cylindrical microelectrodes with diameters down to 40 μm, a micro glow plasma is stably established to show local deposition of the material on silicon substrates. The controlled manipulation of microplasma enables direct film writing of arbitrary patterns, for thicknesses ranging from the 100-nm order up to several microns variable with the discharge and scanning conditions. The process and drawn films are characterized for copper, copper-tungsten alloy, and nickel-200 alloy to reveal its potential applicability for a wide range of target materials. The spectroscopic analysis indicates the films’ elemental compositions to match well with those of the target materials. The direct drawing over non-planar substrates is also demonstrated to show the feasibility of 3D film printing using the developed process.

中文翻译：

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通过微机械电极的溅射直接写入金属膜

摘要 本文介绍了第一个通过微加工靶电极溅射局部沉积和直接写入金属薄膜的微尺度工艺。沉积过程是通过在大气压下在电极尖端和基板之间产生的高度受限的微直流辉光等离子体实现的。使用直径低至 40 μm 的圆柱形微电极，可以稳定地建立微辉光等离子体，以显示材料在硅基板上的局部沉积。微等离子体的受控操作可以直接写入任意图案的薄膜，厚度范围从 100 纳米级到几微米不等，随放电和扫描条件而变化。铜、铜钨合金、和镍 200 合金，以揭示其对各种目标材料的潜在适用性。光谱分析表明薄膜的元素组成与目标材料的元素组成很好地匹配。还演示了在非平面基板上的直接绘图，以显示使用开发的工艺进行 3D 薄膜打印的可行性。