Abstract It is widely accepted that nano pores of sintered nanoparticles can coalesce into micro pores during high temperature service. When applying sintered nanoparticles in power electronics, the pore segregation and delamination seriously degrade the bond strength and thermal conductivity, but the reason is still not well understood. In this paper, both finite element analysis and experimental results confirmed that thermal stress is the main driving force for this phenomenon, which was not considered in the previous study. The effect of pore segregation on performance and reliability of power devices is also discussed.

中文翻译：

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用于高温电力电子应用的烧结纳米银的孔隙偏析机制

摘要 烧结纳米粒子的纳米孔在高温使用过程中会聚结成微孔已被广泛接受。在电力电子中应用烧结纳米颗粒时，孔隙偏析和分层严重降低了结合强度和热导率，但其原因尚不清楚。在本文中，有限元分析和实验结果均证实热应力是该现象的主要驱动力，这在之前的研究中没有考虑。还讨论了孔隙偏析对功率器件性能和可靠性的影响。