In this work, pure Sn was used to wet Zr_50.7Cu₂₈Ni₉Al_12.3 bulk metallic glasses (BMGs) assisted by ultrasonic. Without ultrasonic treatment, pure Sn showed a non-wetting condition to BMG. Ultrasonic vibration facilitated the wetting of Sn to BMG. Prior to ultrasonication for 30 s, only physical adsorption formed at the Sn/BMG interface. Increasing ultrasonic time led to the alteration of the bond at the Sn/BMG interface from point contact to local surface contact, and to diffusion layer. Two bonding modes of order–order and order–disorder were discovered at the Sn/BMG interface. Cu content was higher than the other elements near the bonding interface. Longer diffusion distances of Sn into the BMG were obtained at high ultrasonic power, high temperature and large dip depth.

在这项工作中，使用纯锡润湿Zr _50.7 Cu ₂₈ Ni ₉ Al _12.3超声波辅助的大块金属玻璃（BMG）。未经超声处理，纯锡对BMG表现出非润湿状态。超声波振动促进了锡向BMG的浸润。在超声处理30 s之前，只有物理吸附形成在Sn / BMG界面上。超声时间的增加导致Sn / BMG界面处的键从点接触变为局部表面接触，并扩散到扩散层。在Sn / BMG界面上发现了有序的两种结合模式：有序和无序。Cu含量高于键合界面附近的其他元素。在较高的超声功率，较高的温度和较大的浸入深度下，可以获得更长的Sn扩散到BMG中的距离。