当前位置: X-MOL 学术Microchem. J. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Removal of Cu 2+ and Ni 2+ from aqueous solution using SnO 2 nanomaterial effect of: pH, time, temperature, interfering cations
Microchemical Journal ( IF 4.9 ) Pub Date : 2018-09-01 , DOI: 10.1016/j.microc.2018.05.020
Abigail M. Zepeda , Daisy Gonzalez , Luis Gonzalez Heredia , Karina Marquez , Cesar Perez , Erika Pena , K. Flores , C. Valdes , T.M. Eubanks , J.G. Parsons , J. Cantu

Tin oxide, SnO2, nanomaterial was synthesized and tested for the removal of Cu2+ and Ni2+ ions from aqueous solutions. Various parameters for the binding were investigated in batch studied, which included pH, time, temperature, and interferences. In addition, isotherm studied were performed to determine the maximum binding capacity for both Cu2+ and Ni2+ ions. The optimal binding pH determined from the effects of pH were to be at pH 5 for both the Cu2+ and Ni2+ ions. The isotherm studies were performed at temperatures of 4°C, 25 °C, and 45 °C for both the Cu2+ and Ni2+ ions and were found to follow the Langmuir isotherm model. The binding capacities for the Cu2+ ions were 2.63 mg/g, 2.95 mg/g and 3.27 mg/g at the aforementioned temperatures, respectively. Whereas the binding capacities for Ni2+ were 0.79 mg/g, 1.07 mg/g, and 1.46 mg/g at the respective temperatures. The determined thermodynamic parameters for the binding showed that the binding processes for the reactions were endothermic, as the ΔG was observed to decrease with decreasing temperatures. As well the ΔH was 28.73 kJ/mol for Cu2+ (III) and 13.37 kJ/mol for Ni2+. The ΔS was observed to be 92.65 J/mol for Cu2+ and 54.53 J/mol for Ni2+. The free energy of adsorption for the Cu2+ was determined to be 13.99 kJ/mol and the activation energy for the binding of Ni2+ was determined to be 8.09 KJ/mol. The activation energy data indicate that the reaction was occurring through chemisorption.

中文翻译:

使用 SnO 2 纳米材料从水溶液中去除 Cu 2+ 和 Ni 2+ 影响:pH、时间、温度、干扰阳离子

合成了氧化锡、SnO2、纳米材料,并测试了从水溶液中去除 Cu2+ 和 Ni2+ 离子的能力。分批研究结合的各种参数,包括 pH、时间、温度和干扰。此外,还进行了等温线研究以确定 Cu2+ 和 Ni2+ 离子的最大结合容量。对于Cu2+ 和Ni2+ 离子,从pH 的影响确定的最佳结合pH 为pH 5。Cu2+ 和 Ni2+ 离子的等温线研究在 4°C、25°C 和 45°C 的温度下进行,并发现遵循 Langmuir 等温线模型。在上述温度下,Cu2+ 离子的结合能力分别为 2.63 mg/g、2.95 mg/g 和 3.27 mg/g。而 Ni2+ 的结合能力为 0.79 mg/g、1.07 mg/g 和 1。在相应温度下为 46 mg/g。确定的结合热力学参数表明反应的结合过程是吸热的,因为观察到 ΔG 随温度降低而降低。同样,Cu2+ (III) 的ΔH 为28.73 kJ/mol,Ni2+ 的ΔH 为13.37 kJ/mol。观察到 Cu2+ 的 ΔS 为 92.65 J/mol,Ni2+ 为 54.53 J/mol。Cu2+ 的吸附自由能测定为 13.99 kJ/mol,Ni2+ 结合的活化能测定为 8.09 KJ/mol。活化能数据表明反应是通过化学吸附发生的。同样,Cu2+ (III) 的ΔH 为28.73 kJ/mol,Ni2+ 的ΔH 为13.37 kJ/mol。观察到 Cu2+ 的 ΔS 为 92.65 J/mol,Ni2+ 为 54.53 J/mol。Cu2+ 的吸附自由能测定为 13.99 kJ/mol,Ni2+ 结合的活化能测定为 8.09 KJ/mol。活化能数据表明反应是通过化学吸附发生的。同样,Cu2+ (III) 的ΔH 为28.73 kJ/mol,Ni2+ 的ΔH 为13.37 kJ/mol。观察到 Cu2+ 的 ΔS 为 92.65 J/mol,Ni2+ 为 54.53 J/mol。Cu2+ 的吸附自由能测定为 13.99 kJ/mol,Ni2+ 结合的活化能测定为 8.09 KJ/mol。活化能数据表明反应是通过化学吸附发生的。
更新日期:2018-09-01
down
wechat
bug