Photonic integrated circuits (PICs) are attractive platforms to perform large-scale quantum information processing. While highly functional PICs (e.g., silicon-based photonic circuits) and high-performance single-photon sources [SPSs, e.g., compound-semiconductor quantum dots (QDs)] have been independently demonstrated, their combination for single-photon-based applications has still been limited. This is largely due to the complexities of introducing SPSs into existing PIC platforms, which are generally realized with different materials and using distinct fabrication protocols. Here, we report a novel approach to combine SPSs and PICs prepared independently. We employ transfer printing, by which multiple desired SPSs can be integrated in a simple pick-and-place manner with a theoretical waveguide coupling efficiency $>99\%$, fulfilling the demanding requirements of large-scale quantum applications. Experimentally, we demonstrated QD-based SPSs with high waveguide coupling efficiencies, together with the integration of two SPSs into a waveguide. Our approach will accelerate scalable fusion between modern PICs and cutting-edge quantum technologies.

中文翻译：

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转移印刷单光子源耦合到线波导

光子集成电路（PIC）是执行大规模量子信息处理的有吸引力的平台。尽管已经独立展示了功能强大的PIC（例如，基于硅的光子电路）和高性能单光子源[SPS，例如，化合物半导体量子点（QD）]，但它们已结合用于基于单光子的应用仍然受到限制。这主要是由于将SPS引入现有PIC平台的复杂性，通常是使用不同的材料并使用不同的制造协议来实现。在这里，我们报告了一种结合了独立准备的SPS和PIC的新颖方法。我们采用转移印刷，通过这种转移印刷，可以以简单的拾放方式将多个所需的SPS集成在一起，并具有理论上的波导耦合效率$>99％$，满足大规模量子应用的苛刻要求。通过实验，我们演示了具有高波导耦合效率的基于QD的SPS，以及将两个SPS集成到波导中的方法。我们的方法将加速现代PIC与尖端量子技术之间的可扩展融合。