Enhancing Molecular Alignment and Charge Transport of Solution‐Sheared Semiconducting Polymer Films by the Electrical‐Blade Effect,Advanced Electronic Materials

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Enhancing Molecular Alignment and Charge Transport of Solution‐Sheared Semiconducting Polymer Films by the Electrical‐Blade Effect
Advanced Electronic Materials ( IF 5.3 ) Pub Date : 2018-05-21 , DOI: 10.1002/aelm.201800110
Francisco Molina-Lopez ₁ , Hung-Chin Wu ₁ , Ging-Ji Nathan Wang ₁ , Hongping Yan _{1,

2} , Leo Shaw ₁ , Jie Xu ₁ , Michael F. Toney ₂ , Zhenan Bao ₁

Affiliation

Controlling polymer chain alignment through processing is a means of tuning the charge transport of solution‐based conjugated polymers. In this work, a processing strategy is proposed in which an external electric field (E‐field) is applied to the coating blade (E‐blade) to align polymer chain during solution‐shearing, a meniscus‐guided coating technique. A theoretical model based on dielectrophoresis quantitatively describes and predicts the alignment process and is used to guide the selection of the optimal conditions of the applied E‐field. Using these conditions, more than twofold increase in chain alignment is observed for E‐bladed thin films of a diketopyrrolopyrrole (DPP) semiconducting polymer without affecting other morphological aspects such as film thickness, film coverage, or fiber‐like aggregation. Organic field effect transistors based on the E‐bladed DPP polymer are fabricated at ambient conditions and over areas of a few cm². They display a threefold improvement in their mobilities and a strong enhancement in charge transport anisotropy compared to films prepared without E‐field. These results reveal a synergistic alignment effect from both the solution‐shearing process and the applied E‐field, and introduce a novel and general approach to control the morphology and the electrical properties of solution‐coated conjugated polymer thin films.

中文翻译：

通过电叶片效应增强溶液剪切的半导体聚合物薄膜的分子排列和电荷传输

通过加工控制聚合物链的排列是调节基于溶液的共轭聚合物的电荷传输的一种手段。在这项工作中，提出了一种处理策略，其中在溶液剪切过程中采用弯月引导的涂覆技术，在涂覆刀片（E刀片）上施加外部电场（电场）以对齐聚合物链。基于介电电泳的理论模型定量地描述和预测了比对过程，并用于指导选择所施加电场的最佳条件。在这些条件下，二酮吡咯并吡咯（DPP）半导体聚合物的E叶片薄膜的链排列增加了两倍以上，而没有影响其他形态方面，例如薄膜厚度，薄膜覆盖率或类纤维聚集。²。与没有电场制备的薄膜相比，它们的迁移率提高了三倍，电荷传输各向异性大大增强。这些结果揭示了溶液剪切过程和施加的电场的协同排列效果，并介绍了一种新颖而通用的方法来控制溶液涂覆的共轭聚合物薄膜的形态和电性能。

更新日期：2018-05-21

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