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Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys
Materials Science and Engineering: A ( IF 6.1 ) Pub Date : 2018-05-18 , DOI: 10.1016/j.msea.2018.05.057
Yongjun Huo , Jiaqi Wu , Chin C. Lee

The major adoptions of silver-based bonding wires and silver-sintering methods in the electronic packaging industry have incited the fundamental material properties research on the silver-based alloys. Recently, an abnormal phenomenon, namely, solid solution softening, was observed in stress vs. strain characterization of Ag-In solid solution. In this paper, the mechanical properties of additional concentrated silver solid solution phases with other solute elements, Al, Ga and Sn, have been experimentally determined, with their work hardening behaviors and the corresponding fractography further analyzed. Particularly, the concentrated Ag-Ga solid solution has been discovered to possess the best combination of mechanical properties, namely, lowest yield strength, highest ductility and highest strength, among the concentrated solid solutions of the current study. Microscopically, a clear evidence of narrow twin lamella feature has been observed in the Ag-Ga solid solution, and further identified as the deformation twinning, using high resolution transmission electron microscopy (HRTEM). To explain solid solution softening mechanism in low Peierls potential FCC metals, the authors have proposed a self-contained theoretical interpretation associated with fractional kink-pairs formation, and originally introduced the concept of the short range order (SRO) induced localized homologous temperature (LHT). Furthermore, the mechanism of twinning-induced plasticity (TWIP) can be referred as the underlying reason of the enhanced ductility in the Ag-Ga solid solution alloy. With such excellent mechanical properties, the Ag-Ga solid solution alloy is expected to have a great potential in the development of advanced joining materials for the various applications in electronics industries.



中文翻译:

浓缩FCC银固溶合金中的固溶软化和增强的延展性

电子包装行业中银基键合线和银烧结方法的主要采用激发了对银基合金的基本材料性能的研究。最近,在Ag-In固溶体的应力-应变表征中观察到异常现象,即固溶体软化。在本文中,通过实验确定了其他浓缩银固溶相与其他溶质元素(铝,镓和锡)的机械性能,并研究了它们的加工硬化行为并进一步分析了相应的分形。特别是,已发现浓缩的Ag-Ga固溶体具有机械性能的最佳组合,即最低的屈服强度,最高的延展性和最高的强度,在当前研究的浓缩固溶体中。在显微镜下,已在Ag-Ga固溶体中观察到窄孪晶薄片特征的清晰证据,并使用高分辨率透射电子显微镜(HRTEM)进一步鉴定为形变孪晶。为了解释低Peierls潜在FCC金属中的固溶软化机理,作者提出了与分数扭结对形成有关的独立理论解释,并最初引入了短程有序(SRO)诱导的局部同源温度(LHT)的概念。 )。此外,孪生诱导可塑性(TWIP)的机制可以被称为Ag-Ga固溶合金中延展性增强的根本原因。具有如此优异的机械性能

更新日期:2018-05-18
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