The influences of ablative layer, soft punch, die depth, and laser energy on novel micro clinching of Al/Cu were investigated. Ablative layer thickness notably influenced metal flow including neck and interlock; the relationship between reasonable ablative layer thickness and certain laser energy range was summarized. Soft punch with 100 μm was more suitable than with other thickness for the process. In the joinable laser energy range, with increase of laser energy, interlock thickness gradually increased, whereas the neck and bottom thicknesses gradually decreased. The process window of Al/Cu combination was acquired, and a certain thickness difference which was at least 40 μm inevitably existed between the upper and lower metal foils. For every joinable combination, matching function of optimum die depth are derived based on Al and Cu foil thickness when the thickness of each metal foil was less than 200 μm. The single lap shearing test showed that the tensile strength and failure model of the joint both depended on neck and interlock thicknesses; only the joint that simultaneously formed a large interlock and large neck can attain a high joining strength.

研究了烧蚀层，软冲头，模具深度和激光能量对Al / Cu新型微压合的影响。烧蚀层的厚度显着影响金属流动，包括颈部和联锁；总结了合理的烧蚀层厚度与一定的激光能量范围之间的关系。具有100μm的软冲头比具有其他厚度的软冲头更适合该过程。在可合并的激光能量范围内，随着激光能量的增加，互锁厚度逐渐增加，而颈部和底部的厚度逐渐减小。获得了Al / Cu组合的工艺窗口，上下金属箔之间不可避免地存在至少40μm的一定厚度差。对于每种可结合的组合，当每个金属箔的厚度小于200μm时，基于Al和Cu箔的厚度得出最佳模具深度的匹配函数。单搭接剪切试验表明，接头的抗拉强度和破坏模型均取决于颈部和联锁装置的厚度。只有同时形成较大的联锁和较大的颈部的接头才能获得较高的接合强度。