With increasing innovations in lithographically patterned glassy carbon (GC) microstructures supported on a flexible polyimide substrate, interest in understanding the nature and strength of the interface between these two materials has come to the forefront. However, although polyimide and glassy carbon have been both extensively studied independently, interface bonds between them in a composite structure have not been investigated. The work presented here investigates the interaction between GC and polyimide at their interface by comparing the infrared spectrum of the composite microstructures (GC bonded to polyimide) to the spectra of both materials alone. A significant difference in the hydroxyl and anhydride peaks between the polyimide, carbon, and composite was found, indicating the presence of not only hydrogen bonding, but also covalent bonding in the composite microstructure. Functionalization of GC through oxygen plasma etching and annealing above 200°C was observed to result in the formation of additional anhydrides. We submit that the presence of these sets of strong covalent bonds opens vast opportunities for a wider usage of variety of robust GC microstructures supported on polyimide substrate.

中文翻译：

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玻碳微电极与聚酰亚胺基体之间界面键合机理的傅里叶变换红外光谱研究

随着在柔性聚酰亚胺衬底上支撑的光刻图案化玻璃碳（GC）微观结构的创新不断发展，人们对了解这两种材料之间的界面的性质和强度的关注已成为最重要的问题。然而，尽管聚酰亚胺和玻璃碳都已被广泛地独立研究，但尚未研究它们在复合结构中的界面键。此处介绍的工作通过将复合材料微结构（GC与聚酰亚胺键合）的红外光谱与两种材料的光谱进行比较，研究了GC和聚酰亚胺在其界面处的相互作用。发现聚酰亚胺，碳和复合材料之间的羟基和酸酐峰存在显着差异，这表明不仅存在氢键，而且在复合材料的微结构中还有共价键。观察到通过氧等离子体蚀刻和在200°C以上退火对GC进行的功能化，导致形成了额外的酸酐。我们认为，这些强共价键组的存在为广泛使用聚酰亚胺基质上支持的各种坚固耐用的气相色谱微结构提供了广阔的机遇。