We describe a fast photocalcination process to prepare highly ordered silica mesoporous films through the use of a low-pressure amalgam arc (λ: 185/254 nm). Because radiant power is 2–3 times higher than conventional low-pressure UV lamps, the elimination of the PEO-b-PPO-b-PEO copolymer template in the 2D hexagonal hybrid film has been completed within 50 min, without damage to the mesostructure. The degradation kinetics are impacted by film thickness and irradiance, but hardly copolymer concentration. Compared to thermocalcination, a narrower pore size distribution and lower energy consumption have been found. Photodegradation mostly originates from a photoablation mechanism induced by radiation at 185 nm, while oxidation due to photogenerated reactive oxygen species plays a minor role. Photocalcination has been combined with an initial photoinduced mesostructuration (detailed in Part 1: Microporous Mesoporous Mater., 257 (2017) 42–50), resulting in an unprecedented “all UV” method to mesoporous silica films. The final process relies on dual wavelength photoactivation: UV_B to form the hybrid copolymer/silica network, a flash intermediate thermal consolidation, and UV_C to decompose the copolymer chains.

我们描述了通过使用低压汞齐弧（λ：185/254 nm）来制备高度有序的二氧化硅介孔膜的快速光煅烧工艺。由于辐射功率是传统低压紫外线灯的2至3倍，因此消除了PEO- b -PPO- b二维六角形杂化膜中的-PEO共聚物模板已在50分钟内完成，而没有破坏介观结构。降解动力学受薄膜厚度和辐照度影响，但几乎不受共聚物浓度的影响。与热煅烧相比，已经发现较窄的孔径分布和较低的能量消耗。光降解主要源于185 nm辐射引起的光烧蚀机制，而光生活性氧导致的氧化作用较小。光煅烧已与初始的光致介观结构结合在一起（在第1部分：微孔中孔材料，257（2017）42–50中详细介绍），从而产生了前所未有的“全紫外线”方法处理中孔二氧化硅薄膜。最终过程取决于双波长光活化：UV _B形成杂化共聚物/二氧化硅网络，快速中间热固结和UV _C分解共聚物链。