Hybrid photonic integration combines complementary advantages of different material platforms, offering superior performance and flexibility compared with monolithic approaches. This applies in particular to multi-chip concepts, where components can be individually optimized and tested. The assembly of such systems, however, requires expensive high-precision alignment and adaptation of optical mode profiles. We show that these challenges can be overcome by in situ printing of facet-attached beam-shaping elements. Our approach allows precise adaptation of vastly dissimilar mode profiles and permits alignment tolerances compatible with cost-efficient passive assembly techniques. We demonstrate a selection of beam-shaping elements at chip and fibre facets, achieving coupling efficiencies of up to 88% between edge-emitting lasers and single-mode fibres. We also realize printed free-form mirrors that simultaneously adapt beam shape and propagation direction, and we explore multi-lens systems for beam expansion. The concept paves the way to automated assembly of photonic multi-chip systems with unprecedented performance and versatility.

混合光子集成结合了不同材料平台的互补优势，与单片方法相比，具有卓越的性能和灵活性。这尤其适用于多芯片概念，在这些概念中可以单独优化和测试组件。然而，这种系统的组装需要昂贵的高精度对准和光学模式轮廓的适配。我们表明，可以通过原位打印面连接的光束整形元素来克服这些挑战。我们的方法可以精确地适应完全不同的模式配置文件，并允许与经济高效的无源装配技术兼容的对准公差。我们演示了在芯片和光纤刻面上的光束整形元件的选择，在边缘发射激光器和单模光纤之间实现高达88％的耦合效率。我们还实现了可同时适应光束形状和传播方向的印刷自由形式反射镜，并且我们探索了用于扩展光束的多透镜系统。该概念为光子多芯片系统的自动化组装铺平了道路，该系统具有空前的性能和多功能性。