This paper addresses the fracture behaviour of bonded composite plates featuring a kissing bond along the crack growth path. Double cantilever beam (DCB) experiments are carried out under a displacement controlled loading condition to acquire the load response. The experimental data are collected and analysed analytically for specimens with and without kissing bond. The following aspects are observed and discussed: effect of the adhesive carrier film, non-smooth crack growth and rising R curve. An analytical model taking into account the aforementioned effects is proposed. The kissing bond leads to unstable crack growth resulting in a loss of the load carrying capacity. The presence of the knit carrier in the adhesive film results in the crack growth process characteristic for the stick-slip phenomena and a significant increase of the resistance to fracture of the bondline by triggering a bridging phenomenon. The model shows a very good agreement with the experimental data. A sound understanding of the fracture process is gained enabling analysis and prediction of the effects of kissing bonds and supporting carrier.

中文翻译：

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CFRP结合接头在I型载荷下的断裂行为：支撑载体和界面污染的影响

本文讨论了具有沿裂纹扩展路径亲吻结合的复合复合板的断裂行为。双悬臂梁 (DCB) 实验在位移控制加载条件下进行，以获取负载响应。收集和分析具有和不具有接吻键的试样的实验数据。观察和讨论了以下几个方面：粘合剂载体膜的影响、不平滑的裂纹扩展和上升的R曲线。提出了一种考虑到上述影响的分析模型。接吻会导致不稳定的裂纹扩展，从而导致承载能力的损失。粘合剂膜中针织载体的存在导致粘滑现象的裂纹扩展过程特征和通过触发桥接现象显着增加粘合层的抗断裂性。该模型与实验数据显示出非常好的一致性。对断裂过程有了充分的了解，从而能够分析和预测接吻键和支撑载体的影响。