In this study, Cu alloy joints were fabricated with a Ni-foam reinforced Sn-based composite solder with the assistance of ultrasonic vibration. Effects of ultrasonic soldering time on the microstructure and mechanical properties of Cu/Ni-Sn/Cu joints were investigated. Results showed that exceptional metallurgic bonding could be acquired with the assistance of ultrasonic vibration using a self-developed Ni-foam/Sn composite solder. For joint soldered for 5 s, a (Cu,Ni)₆Sn₅ intermetallic compound (IMC) layer was formed on the Cu substrate surface, Ni skeletons distributed randomly in the soldering seam and a serrated (Ni,Cu)₃Sn₄ IMC layer was formed on the Ni skeleton surface. Increasing the soldering time to 20 s, the (Ni,Cu)₃Sn₄ IMC layer grew significantly and exhibited a loose porous structure on the Ni skeleton surface. Further increase the soldering time to 30 s, Ni skeletons were largely dissolved in the Sn base solder, and micro-sized (Ni,Cu)₃Sn₄ particles were formed and dispersed homogeneously in the soldering seam. The formation of (Ni,Cu)₃Sn₄ particles was mainly ascribed to acoustic cavitations induced erosion and grain refining effects. The joint soldered for 30 s exhibited the highest shear strength of 64.9 ± 3.3 MPa, and the shearing failure mainly occurred at the soldering seam/Cu substrate interface.

在这项研究中，铜合金接头是由镍泡沫增强的锡基复合焊料在超声振动的辅助下制成的。研究了超声焊接时间对Cu / Ni-Sn / Cu接头组织和力学性能的影响。结果表明，使用自行开发的Ni-foam / Sn复合焊料，借助超声振动可以获得出色的冶金结合。对于5 s的接头焊接，在Cu基板表面形成（Cu，Ni）₆ Sn ₅金属间化合物（IMC）层，Ni骨架随机分布在焊缝中，并形成锯齿状（Ni，Cu）₃ Sn ₄ IMC在Ni骨架表面上形成层。将（Ni，Cu）的焊接时间增加到20 s₃ Sn ₄ IMC层显着生长，并在Ni骨架表面显示出疏松的多孔结构。进一步将焊接时间延长至30 s，Ni骨架大量溶解在Sn基焊料中，形成了微细的（Ni，Cu）₃ Sn ₄颗粒并均匀地分散在焊缝中。（Ni，Cu）₃ Sn ₄颗粒的形成主要归因于空化引起的侵蚀和晶粒细化作用。焊接30 s的接头表现出最高的剪切强度64.9±3.3 MPa，剪切破坏主要发生在焊缝/ Cu基板界面。