High thermal conductive filler (hexagonal boron nitride and carbon nanotube) reinforced polymer composites have obtained a growing attention in the microelectronic industry for their good thermal conductivity but electrical insulating. In this work, a synergistic hybrid structure of two fillers with different dimensions had been designed and prepared by taking hexagonal born nitride (h-BN) platelets and ammine carbon nanotubes (CNT-NH₂) into the flexible polymer matrix. Using cycloaliphatic epoxy resin (CER) as the polymer matrix, a serious of (a) h-BN/CER based, (b) hybrid filler [email protected]₂/CER based, and (c) mixed filler CNT-NH₂ and h-BN/CER based composites were prepared. In this structure, h-BN (and [email protected]₂) platelets stacked along the horizontal direction under the assistance of gravity force and interactivity between the fillers. The orientation of the h-BN platelets was investigated by scanning electron microscope (SEM) of the cracked cross-section of the composite film and XRD measurement via calculating the orientation function (f). The CNT-NH₂ was embedded within the network to improve the filler-filler contact or network-density. Due to the anisotropic properties of h-BN platelets and dispersion states of CNT-NH₂, the composites with different structures presented different and special properties, including thermal/electrical conductivity properties, mechanical properties, and thermal decomposition properties. The analysis of structure and mechanism of thermal decomposition were then proposed to explain those interesting properties. The incorporation and dispersion states of CNT-NH₂ in the composites played an important effect on the enhancement of the thermal conductivity properties both included in-plane (∼1.76 W/m·K) and through-plane (∼1.09 W/m·K) thermal conductivity. Additionally, the good electrical insulating properties and mechanical properties of the composites provided a potential application in the thermal management areas. The solvent-free procedure was environment friendly, easy operation, and suitable for the practical application in large scale.

高导热填料（六方氮化硼和碳纳米管）增强的聚合物复合材料因其良好的导热性和电绝缘性而在微电子工业中受到越来越多的关注。在这项工作中，通过将六边形的氮化物（h-BN）血小板和氨基碳纳米管（CNT-NH ₂）放入柔性聚合物基质中，设计并制备了两种尺寸不同的填料的协同杂化结构。使用脂环族环氧树脂（CER）作为聚合物基体，可以使用（a）h-BN / CER基，（b）[email protected] ₂ / CER杂化填料和（c）CNT-NH ₂混合填料和制备了基于h-BN / CER的复合材料。在这种结构中，h-BN（和[受电子邮件保护] ₂）在重力和填充剂之间的相互作用的帮助下沿水平方向堆叠的血小板。通过扫描复合膜破裂截面的电子显微镜（SEM）研究h-BN血小板的取向，并通过计算取向函数（f）来进行XRD测量。将CNT-NH ₂嵌入网络中以改善填料与填料的接触或网络密度。由于h-BN血小板的各向异性和CNT-NH _2的分散状态，具有不同结构的复合材料表现出不同和特殊的特性，包括热/电导率特性，机械特性和热分解特性。然后提出了热分解的结构和机理的分析，以解释那些有趣的性质。CNT-NH ₂的结合状态和分散状态复合材料中的α对面内导热率（〜1.76 W / m·K）和贯穿面（〜1.09 W / m·K）的热导率特性的提高均起着重要作用。另外，复合材料的良好电绝缘性能和机械性能为热管理领域提供了潜在的应用。无溶剂工艺环境友好，操作简便，适合大规模实际应用。