Electronic Whiskers: 3D, Reconfigurable, Multimodal Electronic Whiskers via Directed Air Assembly (Adv. Mater. 11/2018),Advanced Materials

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Electronic Whiskers: 3D, Reconfigurable, Multimodal Electronic Whiskers via Directed Air Assembly (Adv. Mater. 11/2018)
Advanced Materials ( IF 27.4 ) Pub Date : 2018-03-12 , DOI: 10.1002/adma.201870078
Jonathan T. Reeder ₁ , Tong Kang ₂ , Sarah Rains ₃ , Walter Voit _{1,

2}

Affiliation

An array of 3D air‐assembled electronic whiskers is created parallel to or touching a fingertip by Jonathan T. Reeder and co‐workers in article number 1706733, which demonstrates the ability to interact with and measure 3D topologies in a similar manner to the human finger. Microscale deflections can be sensed with a response time of <250 μs, enabling a variety of distinct sensing modes including proximity, texture mapping, surface roughness, material stiffness, force, and temperature.

中文翻译：

电子晶须：通过定向空气装配的3D，可重构，多模式电子晶须（Adv。Mater。11/2018）

乔纳森·T·里德（Jonathan T. Reeder）和他的同事在货号1706733中创建了一系列平行于或触摸指尖的3D空气组装式电子晶须，展示了以与人的手指相似的方式与之交互和测量3D拓扑的能力。可以以小于250μs的响应时间感测微尺度的挠度，从而实现各种不同的感测模式，包括接近度，纹理贴图，表面粗糙度，材料刚度，力和温度。

更新日期：2018-03-12

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