Abstract With the optimal mass ratio (9/1) of 100 nm–1 μm particles, the bonding layer showed a highly dense sintering structure and was thinner than that of only 100 nm particles, the shear strength of the Cu-Cu joint was over 20 MPa even at relatively low temperature 250 °C and pressure of 4 MPa. The sawtooth structure formed between the bonding layer and the copper substrates can increase the bonding area and further promote the shear strength of joint, the optimal surface roughness of copper substrate for maximum enhanced effect was Ra = 189.9 ± 5.4 nm.

中文翻译：

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Cu微纳米颗粒混合物和表面粗糙度对Cu-Cu接头剪切强度的影响

摘要 100 nm~1 μm 颗粒的最佳质量比（9/1）下，结合层显示出高致密的烧结结构，比仅 100 nm 的颗粒更薄，Cu-Cu 接头的剪切强度超过即使在相对较低的温度 250 °C 和 4 MPa 的压力下，也能达到 20 MPa。结合层与铜基板之间形成的锯齿状结构可以增加结合面积，进一步提高接头的剪切强度，最大增强效果的铜基板的最佳表面粗糙度为Ra=189.9±5.4nm。