The role of amine ligands in governing film morphology and electrical properties of copper films derived from copper formate-based molecular inks†,Nanoscale

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The role of amine ligands in governing film morphology and electrical properties of copper films derived from copper formate-based molecular inks†
Nanoscale ( IF 5.8 ) Pub Date : 2018-03-10 00:00:00 , DOI: 10.1039/c7nr08891d
Chantal Paquet _{1,

2,

3,

4} , Thomas Lacelle _{1,

2,

3,

4} , Xiangyang Liu _{1,

2,

3,

4} , Bhavana Deore _{1,

2,

3,

4} , Arnold J. Kell _{1,

2,

3,

4} , Sylvie Lafrenière _{5,

6,

7} , Patrick R. L. Malenfant _{1,

2,

3,

4}

Affiliation

Copper formate complexes with various primary amines, secondary amines and pyridines were prepared, and their decomposition into conductive films was characterized. A comparison of the various complexes reveals that the temperature of thermolysis depends on the number of hydrogen bonds that can be formed between the amine and formate ligands. The particle size resulting from sintering of the copper complexes is shown to depend on the fraction of amine ligand released during the thermolysis reaction. The particle size in turn is shown to govern the electrical properties of the copper films. Correlations between the properties of the amines, such as boiling point and coordination strength, with the morphology and electrical performance of the copper films were established and provide a basis for the molecular design of copper formate molecular inks.

中文翻译：

胺配体在控制基于甲酸铜的分子墨水衍生的铜膜的膜形态和电性能中的作用†

制备了甲酸铜与各种伯胺，仲胺和吡啶的配合物，并对其分解为导电膜进行了表征。各种配合物的比较表明，热解温度取决于胺和甲酸酯配体之间可形成的氢键数量。示出了由铜络合物的烧结产生的粒度取决于在热解反应期间释放的胺配体的分数。依次显示出粒度控制着铜膜的电性能。建立了胺的性质（如沸点和配位强度）与铜膜的形态和电性能之间的相关性，并为甲酸铜分子油墨的分子设计提供了基础。

更新日期：2018-03-10

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