Abstract The work deals with the problem of fabricating new materials for modern devices of microelectromechanics, microelectronics, biomimetics, etc. using the local electrodeposition of metals. The mathematical model is developed for the formation of 3D microstructures (microcolumns) by the local electrochemical deposition of metal using a moving disk microanode. The numerical solution of the mathematical problem is performed using the finite element method on the irregular grid. The grid is deformed and adaptively remeshed during modeling of deposit growth. Evolution of deposit surface is calculated for various exchange current densities, transfer coefficients, interelectrode distances and various dependences of the current efficiency on the current density. The results of modeling allow one to determine the relationships between the parameters of electrodeposition and the shape and dimensions of formed microstructures. These data can be used to predict the results of local electrodeposition of metal and to optimize the operation conditions.

中文翻译：

---

金属微柱局部无掩模电化学沉积的建模

摘要 这项工作涉及利用金属的局部电沉积为现代微机电、微电子、仿生等设备制造新材料的问题。该数学模型是为通过使用移动圆盘微阳极对金属进行局部电化学沉积来形成 3D 微结构（微柱）而开发的。数学问题的数值求解是在不规则网格上使用有限元方法进行的。在沉积物增长建模期间，网格会变形并自适应地重新划分网格。针对各种交换电流密度、转移系数、电极间距离和电流效率对电流密度的各种依赖性，计算沉积表面的演变。建模的结果允许人们确定电沉积参数与形成的微结构的形状和尺寸之间的关系。这些数据可用于预测金属局部电沉积的结果并优化操作条件。