Abstract Microstructure and properties of Cu/Ti laser welded joints. The optical microscopy, SEM, EDS, XRD and TEM were applied to assess the microstructure and bonding mechanism of Cu/Ti joints. When the laser beam was used to irradiate the copper side with an offset value of 0.45 mm, the welded metal and fusion line of Cu side were mainly consisted of the Cu solid solution. The intermetallic layer was formed at the titanium-welded metal interface. The thickness of IMCs was about 25 μm and consisted of the Cu solid solution, intermetallic compounds such as TiCu, TiCu2, Ti2Cu and Ti3Cu4. The tensile strength of butt joints could reach 151 MPa, i.e. 61% of the tensile strength of the copper base metal. The quasi-cleavage fracture occurred at the IMCs.

中文翻译：

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Cu/Ti激光焊接接头的组织与性能

摘要 Cu/Ti激光焊接接头的组织与性能。应用光学显微镜、SEM、EDS、XRD 和 TEM 来评估 Cu/Ti 接头的微观结构和结合机制。当用激光束照射偏移值为 0.45 mm 的铜侧时，Cu 侧的焊接金属和熔合线主要由 Cu 固溶体组成。在钛焊接金属界面处形成金属间化合物层。IMCs 的厚度约为 25 μm，由 Cu 固溶体、TiCu、TiCu2、Ti2Cu 和 Ti3Cu4 等金属间化合物组成。对接接头的抗拉强度可达151 MPa，即铜母材抗拉强度的61%。准解理断裂发生在 IMC 处。