Kirigami enhances film adhesion†,Soft Matter

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Kirigami enhances film adhesion†
Soft Matter ( IF 2.9 ) Pub Date : 2018-03-05 00:00:00 , DOI: 10.1039/c7sm02338c
Ruike Zhao _{1,

2,

3} , Shaoting Lin _{1,

2,

3} , Hyunwoo Yuk _{1,

2,

3} , Xuanhe Zhao _{1,

2,

2,

3,

4}

Affiliation

Structures of thin films bonded on substrates have been used in technologies as diverse as flexible electronics, soft robotics, bio-inspired adhesives, thermal-barrier coatings, medical bandages, wearable devices and living devices. The current paradigm for maintaining adhesion of films on substrates is to make the films thinner, and more compliant and adhesive, but these requirements can compromise the function or fabrication of film–substrate structures. For example, there are limits on how thin, compliant and adhesive epidermal electronic devices can be fabricated and still function reliably. Here we report a new paradigm that enhances adhesion of films on substrates via designing rational kirigami cuts in the films without changing the thickness, rigidity or adhesiveness of the films. We find that the effective enhancement of adhesion by kirigami is due to (i) the shear-lag effect of the film segments; (ii) partial debonding at the film segments’ edges; and (iii) compatibility of kirigami films with inhomogeneous deformation of substrates. While kirigami has been widely used to program thin sheets with desirable shapes and mechanical properties, fabricate electronics with enhanced stretchability and design the assembly of three-dimensional microstructures, this paper gives the first systematic study on kirigami enhancing film adhesion. We further demonstrate novel applications including a kirigami bandage, a kirigami heat pad and printed kirigami electronics.

中文翻译：

Kirigami增强了薄膜的附着力†

粘合在基板上的薄膜结构已用于各种技术中，例如柔性电子，软机器人，生物启发性粘合剂，热障涂层，医用绷带，可穿戴设备和生活设备。维持薄膜在基材上的粘附力的当前范例是使薄膜更薄，更柔顺和更具粘性，但是这些要求可能会损害薄膜-基材结构的功能或制造。例如，在如何制造薄的，顺应性的和粘附性的表皮电子设备方面仍然存在限制，并且仍然可靠地起作用。在这里，我们报告了一种新的范例，该范例通过在不改变薄膜的厚度，刚度或粘合性的前提下，设计合理的千纸鹤切工即可切割薄膜。我们发现，通过切纸有效地增强粘附力是由于（i）薄膜片段的剪切滞后效应；（ii）在膜片段的边缘部分脱粘；（iii）kirigami膜与基材的不均匀变形的相容性。虽然kirigami已被广泛用于对具有所需形状和机械性能的薄板进行编程，制造具有增强的可拉伸性的电子产品以及设计三维微结构的装配，但本文还是首次对kirigami增强膜的附着力进行了系统的研究。我们进一步演示了新颖的应用，包括kirigami绷带，kirigami热垫和印刷的kirigami电子产品。

更新日期：2018-03-05

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