The effects of water quenching temperature and specimen size on the propagation speed of thermal shock crack are investigated in real time by water quenching of translucent ceramic and high-speed imaging. The results show that the crack growth rate increases with the increase of quenching temperature difference or specimen size. Within 100 ms, average crack speed is 20.3 mm/s at a temperature difference of 400 °C in 20 mm wide ceramic and is 11.9 mm/s at a temperature difference of 220 °C in 5 mm wide ceramic, respectively. Compare with specimen size, the influence of quenching temperature difference on the crack propagation speed is larger. The calculations based on meso-damage mechanics have similar results to those of experiments. This paper quantitatively studies the thermal-shock crack growth of ceramic in real time and expands the scientific understanding of thermal shock cracking phenomenon of ceramic.

通过半透明陶瓷水淬和高速成像，实时研究了水淬温度和试样尺寸对热冲击裂纹扩展速度的影响。结果表明，裂纹扩展速率随着淬火温度差或试样尺寸的增加而增加。在100毫秒内，宽20毫米的陶瓷在温度差为400°C时的平均开裂速度为20.3 mm / s，宽5 mm的陶瓷在温度差为220°C时平均开裂速度为11.9 mm / s。与试样尺寸相比，淬火温差对裂纹扩展速度的影响更大。基于细观损伤力学的计算结果与实验结果相似。