Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material†,Journal of Materials Chemistry C

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Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material†
Journal of Materials Chemistry C ( IF 5.7 ) Pub Date : 2018-02-21 00:00:00 , DOI: 10.1039/c8tc00547h
Biao Zhao _{1,

2,

3} , Chongxiang Zhao _{1,

2,

3} , Chongda Wang _{1,

2,

3} , Chul B. Park _{1,

2,

3}

Affiliation

In this study, we used a batch-foaming method to prepare closed-cell poly(vinylidene fluoride) (PVDF) foams with tailored microcellular structures. This is a simple, cost-effective, and environmentally-friendly method, and it offers a wide range of tunable microcellular structures. The cell size and porosity volume of PVDF foams can be effectively monitored at their saturation temperatures. The PVDF foam prepared at 169.5 °C possesses an ultra-low dielectric constant of k ∼ 1.1 and a thermal conductivity of 0.027 W m⁻¹ K⁻¹. We used numerous theoretical models to predict the effective dielectric permittivity of the microcellular PVDF foams, and found that the Bruggeman model was very close to the measured results. The ultra-low thermal conductivities of the PVDF foams were the result of a large number of air pockets in the microcellular structure. Based on these results, we concluded that this PVDF foam would be a promising low-k dielectric and heat insulating material.

中文翻译：

聚偏二氟乙烯泡沫：一种有前途的低k介电和隔热材料†

在这项研究中，我们使用分批发泡的方法来制备具有定制的微孔结构的闭孔聚偏二氟乙烯（PVDF）泡沫。这是一种简单，经济高效且环保的方法，它提供了广泛的可调微孔结构。可以在饱和温度下有效监控PVDF泡沫的泡孔尺寸和孔隙率。在169.5℃下制备的PVDF具有泡沫的超低介电常数ķ〜1.1和0.027脉冲W M的热传导率^-1 ķ ^-1。我们使用了许多理论模型来预测微孔PVDF泡沫的有效介电常数，并发现Bruggeman模型与测量结果非常接近。PVDF泡沫的超低导热率是微孔结构中大量气穴的结果。根据这些结果，我们得出结论，这种PVDF泡沫材料将是一种很有前途的低k介电和隔热材料。

更新日期：2018-02-21

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