Abstract Tin (Sn) or a Sn-rich solder applied to copper-based artefacts has been frequently used at least, since the Ancient Greece, although scarce studies have been published concerning the technology of this metallurgical joining technique. Several filler remnants were reported to be found in a Roman collection of handle attachments of situlae or cauldrons (2nd century BCE–5th century CE) from the archaeological site of Conimbriga, a Roman city from the Lusitania Province (Portugal). All these artefacts were cast in high leaded coppers and bronzes. The present study aims to contribute to the knowledge of Sn-rich soldering, an ancient metallurgical joining technique, by the characterisation of the fusible metallic alloy present in 10 Roman artefacts by means of micro-energy dispersive X-ray fluorescence spectrometry (micro-EDXRF), scanning electron microscopy with energy dispersive X-ray (SEM-EDS) microanalysis and optical microscope (OM) observations. Results of studied solders show the presence of Cu-Sn alloys, with Sn contents ranging from δ to η phase composition (30–60 wt% Sn). As the attachments were made in leaded copper alloys, it was also observed, in some cases, the melting of the interdendritic Pb-rich chains with long-range diffusion of the solder alloy into the substrate. The fillers compositions suggest that the handle attachments have been joined to a situla body by the soldering metallurgical process with Sn or a Sn-rich alloy. The studied leaded Cu-Sn attachments, probably formulated by local craftsman, were joined into the body of a situla or cauldron with a soft solder (soldering), a common metallurgical joint from Antiquity, although no relation was found between composition or typology and the Sn or Sn-rich solder.

中文翻译：

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在来自 Conimbriga（葡萄牙）的 Roman situlae 的手柄附件中发现的锡焊的 Micro-EDXRF、SEM-EDS 和 OM 表征

摘要 锡 (Sn) 或应用于铜基制品的富锡焊料至少自古希腊以来就经常使用，尽管关于这种冶金连接技术的研究很少发表。据报道，在来自卢西塔尼亚省（葡萄牙）的罗马城市 Conimbriga 的考古遗址中，在罗马收集的 situlae 或大锅的手柄附件（公元前 2 世纪至公元 5 世纪）中发现了一些填充物残余物。所有这些文物都是用高铅铜和青铜铸造的。本研究旨在通过微能量色散 X 射线荧光光谱法 (micro-EDXRF) 表征 10 件罗马文物中存在的易熔金属合金，为了解富锡焊接这一古老的冶金连接技术做出贡献。 ), 具有能量色散 X 射线 (SEM-EDS) 显微分析和光学显微镜 (OM) 观察的扫描电子显微镜。研究焊料的结果表明存在 Cu-Sn 合金，Sn 含量范围从 δ 到 η 相组成（30-60 wt% Sn）。由于附件是用含铅铜合金制成的，在某些情况下，还观察到枝晶间富铅链熔化，焊料合金长距离扩散到基板中。填料成分表明手柄附件已通过焊接冶金工艺与锡或富锡合金连接到原位主体。所研究的含铅 Cu-Sn 附件可能由当地工匠配制，用软焊料（焊接）连接到锅体或大锅的主体中，软焊料是古代常见的冶金接头，