High-temperature thermal insulation materials challenge extensive candidates with good mechanical, thermal and chemical reliability at high temperatures. Recently, porous γ-Y₂Si₂O₇ was indicated a promising thermal insulator in harsh environment; however, its strength at 1300 °C reduced to 34% of that at room temperature. In this work, we significantly improved its high-temperature strength by doping Ho. Highly porous γ-(Y_1-xHo_x)₂Si₂O₇ solid solution was fabricated by in-situ foam-gelcasting method. Especially, porous γ-(Y_2/3Ho_1/3)₂Si₂O₇ demonstrated the optimal high-temperature strength, for instance 65% retention at 1300 °C, as well as high compressive strength (13.9 MPa) and low thermal conductivity (0.186 W/(m K)) at room temperature, at the porosity of 79.3%. Interestingly, porous solid solution sample displayed obviously lower thermal conductivity than the two end pure-phase porous materials. Porous γ-(Y_1-xHo_x)₂Si₂O₇ solid solution is clearly highlighted as a promising high-temperature thermal insulator with outstanding high-temperature strength retention and optimal low thermal conductivity.

高温绝热材料以其在高温下良好的机械，热和化学可靠性挑战了广泛的候选材料。近来，多孔γ-Y ₂的Si ₂ ö ₇是表示在恶劣的环境下有希望的热绝缘体; 但是，它在1300°C时的强度降至室温下的34％。在这项工作中，我们通过掺杂Ho显着提高了其高温强度。采用原位泡沫凝胶法制备了高孔隙率的γ-（Y _1-x Ho _x）₂ Si ₂ O ₇固溶体。特别是多孔γ-（Y _2/3 Ho _1/3）₂ Si ₂O ₇表现出最佳的高温强度，例如在1300°C下保持65％的孔隙率，以及在室温下的高孔隙率下的高抗压强度（13.9 MPa）和低热导率（0.186 W /（m K））。占79.3％。有趣的是，多孔固溶体样品的热导率明显低于两端的纯相多孔材料。γ-（Y _1-x Ho _x）₂ Si ₂ O ₇多孔固溶体显然是一种有前途的高温绝热体，具有出色的高温强度保持性和最佳的低导热性。