Efficient solution-based growth of electronic materials is needed to enable low-cost wearable electronics, medical sensors, soft robotics, and energy harvesting technologies. In this study, a wetting-mediated two-phase dip coating method is developed to deposit high-performance organic semiconductor stripes at pre-specified locations on rigid, flexible, and three-dimensional substrates. This approach produces highly-oriented 6,13-bis(triisopropylsilylethynyl)pentacene (TIPS-pentacene) crystallites, leading to hole mobilities up to 0.83 cm² V⁻¹ s⁻¹ along the crystallite axis. The deposition method requires minimal amounts of starting material (4 μL per centimeter of substrate length) and can easily be scaled for deposition onto large (meter-scale) substrates. Wetting-mediated two-phase dip coating also enables the targeted deposition of organic semiconductors onto folded and complex three-dimensional substrates creating new opportunities for unconventional electronic applications.

中文翻译：

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将有机半导体条带定向沉积到刚性，柔性和三维基板上†

需要基于解决方案的有效电子材料增长，以实现低成本的可穿戴电子设备，医疗传感器，软机器人技术和能量收集技术。在这项研究中，开发了一种润湿介导的两相浸涂法，以在刚性，柔性和三维基板上的预定位置沉积高性能有机半导体条带。这种方法可产生高度定向的6,13-​​双（三异丙基甲硅烷基乙炔基）并五苯（TIPS-并五苯）微晶，导致空穴迁移率高达0.83 cm ² V ^-1 s ^-1沿微晶轴。沉积方法需要最少的起始原料（4μL/厘米的基板长度），可以轻松缩放以沉积到大型（米级）基板上。润湿介导的两相浸涂还可以将有机半导体定向沉积到折叠的复杂三维基板上，从而为非常规电子应用创造了新的机遇。