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Solid‐Solution Alloy Nanoparticles of the Immiscible Iridium–Copper System with a Wide Composition Range for Enhanced Electrocatalytic Applications
Angewandte Chemie International Edition ( IF 16.1 ) Pub Date : 2018-03-13 , DOI: 10.1002/anie.201800650
Fenglong Wang 1 , Kohei Kusada 1 , Dongshuang Wu 1 , Tomokazu Yamamoto 2, 3 , Takaaki Toriyama 3 , Syo Matsumura 2, 3, 4 , Yusuke Nanba 4 , Michihisa Koyama 4 , Hiroshi Kitagawa 1, 4
Affiliation  

For the first time, we synthesize solid‐solution alloy nanoparticles of Ir and Cu with a size of ca. 2 nm, despite Ir and Cu being immiscible in the bulk up to their melting over the whole composition range. We performed a systematic characterization on the nature of the IrxCu1−x solid‐solution alloys using powder X‐ray diffraction, scanning transmission electron microscopy coupled with energy‐dispersive X‐ray spectroscopy and X‐ray photoelectron spectroscopy. The results showed that the IrxCu1−x alloys had a face‐centered‐cubic structure; charge transfer from Cu to Ir occurred in the alloy nanoparticles, as the core‐level Ir 4f peaks shifted to lower energy region with the increase in Cu content. Furthermore, we observed that the alloying of Ir with Cu enhanced both the electrocatalytic oxygen evolution and oxygen reduction reactions. The enhanced activities could be attributed to the electronic interaction between Ir and Cu arising from the alloying effect at atomic‐level.

中文翻译:

具有广泛组成范围的不混溶铱铜系统的固溶合金纳米颗粒,可增强电催化应用

首次,我们合成了尺寸约为ca的Ir和Cu固溶体合金纳米颗粒。尽管Ir和Cu在整个组成范围内直至其熔融状态都不能混溶,但仍为2 nm。我们使用粉末X射线衍射,扫描透射电子显微镜,能量色散X射线光谱学和X射线光电子能谱对Ir x Cu 1 - x固溶合金的性质进行了系统的表征。结果表明,Ir x Cu 1- x合金具有面心立方结构。随着Cu含量的增加,随着核心水平的Ir 4f峰移至较低的能量区域,在合金纳米粒子中发生了从Cu到Ir的电荷转移。此外,我们观察到Ir与Cu的合金化增强了电催化氧的释放和氧还原反应。增强的活性可以归因于Ir和Cu之间的电子相互作用,这是由于原子级的合金化作用引起的。
更新日期:2018-03-13
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