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Ultralow electrical percolation in melt-compounded polymer composites based on chemically expanded graphite
Composites Science and Technology ( IF 8.3 ) Pub Date : 2018-04-01 , DOI: 10.1016/j.compscitech.2018.01.022
Peng Wang , Haodan Chong , Jiajia Zhang , Yanhao Yang , Hongbin Lu

Abstract It has been difficult to construct electrical percolation networks in melt-compounded polymer composites due to shear-induced network destruction, especially for low graphene content composites. To overcome this issue, here we employ chemically expanded graphite (CEG) to construct conductive networks in which the polymer molecules would penetrate into the inner part of CEG to form a polymer entrapped in CEG structure. This novel polymer entrapped in CEG structure is very useful for the effective charge transfer and further construction of conductive networks in the process of melt compounding. The final polymer composites exhibit an ultralow electrical conductive percolation threshold of 0.29 vol% after melt compounding which is almost among the lowest level compared with those of other melt-compounded polymer composites. Besides, the thermal conductivity of the composites is also significantly enhanced. This strategy here has provided a new way to maintain the conductive networks and decrease the electrical percolation threshold in the melt-compounded polymer composites through constructing polymer entrapped in conductive fillers structure.

中文翻译:

基于化学膨胀石墨的熔融复合聚合物复合材料中的超低电渗透

摘要 由于剪切引起的网络破坏,在熔融复合聚合物复合材料中构建电渗流网络一直很困难,特别是对于低石墨烯含量的复合材料。为了克服这个问题,我们在这里使用化学膨胀石墨 (CEG) 来构建导电网络,其中聚合物分子将渗透到 CEG 内部以形成包裹在 CEG 结构中的聚合物。这种包裹在 CEG 结构中的新型聚合物对于在熔融复合过程中有效的电荷转移和进一步构建导电网络非常有用。最终的聚合物复合材料在熔融复合后表现出 0.29 vol% 的超低导电渗透阈值,与其他熔融复合聚合物复合材料相比,这几乎是最低水平。除了,复合材料的导热性也显着提高。这种策略通过构建夹带在导电填料结构中的聚合物,提供了一种新的方法来维持导电网络并降低熔融复合聚合物复合材料中的电渗透阈值。
更新日期:2018-04-01
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