Polymer composites with high thermal conductivity have a great potential application in modern electronics, due to their light-weight, easy process, low cost and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory thermal conductivity, primarily because of the high interfacial thermal resistance between inorganic fillers. Herein, we report a novel method through silver-deposition on the surface of the fillers to create a silver nanoparticle “bridge”, to decrease the interfacial thermal resistance between fillers. The results demonstrate that the out-of-plane thermal conductivity of the epoxy resin/sphere alumina composites is increased to 1.304 W m⁻¹ K⁻¹, representing an improvement of 624% compared with pure epoxy resin. This strategy provides an insight for the design of thermally conductive polymer composites with potential to be used in next-generation electronic packaging.

具有高导热性的聚合物复合材料由于其重量轻，易于加工，成本低以及稳定的物理和化学性质而在现代电子产品中具有广阔的应用前景。然而，大多数聚合物复合材料通常具有不令人满意的热导率，这主要是由于无机填料之间的高界面热阻。在这里，我们报道了一种通过在填料表面上进行银沉积以形成银纳米粒子“桥”的新方法，以降低填料之间的界面热阻。结果表明，环氧树脂/球形氧化铝复合材料的平面外热导率提高到1.304 W m ^-1  K ^-1，与纯环氧树脂相比，提高了624％。该策略为设计具有潜力用于下一代电子封装的导热聚合物复合材料提供了见识。