With the advances of the electronics industry, the continuing trend of miniaturization and integration imposes challenges of efficient heat removal in nanoelectronic devices. Two-dimensional (2D) materials, especially graphene and hexagonal boron nitride (h-BN), are widely accepted as ideal candidates for thermal management materials due to their high intrinsic thermal conductivity and good mechanical flexibility. In this review, we introduce phonon dynamics of solid materials and thermal measurement methods at nanoscale, and highlight the unique thermal properties of 2D materials in relation to sample thickness, domain size, and interfaces. In addition, we discuss recent achievements of thermal management applications in which 2D materials act as heat spreader and thermal interface materials based on their controlled growth and self-assembly. Finally, critical consideration on the challenges and opportunities in thermal management applications of 2D materials is presented.

随着电子工业的发展，小型化和集成化的持续趋势对纳米电子器件的有效散热提出了挑战。二维（2D）材料，尤其是石墨烯和六方氮化硼（h-BN），由于其固有的高导热性和良好的机械柔韧性而被广泛接受为热管理材料的理想选择。在这篇综述中，我们介绍了固体材料的声子动力学和纳米级的热测量方法，并重点介绍了二维材料在样品厚度，畴尺寸和界面方面的独特热性能。另外，我们讨论了热管理应用的最新成就，在这些应用中，二维材料基于其受控的增长和自组装而充当散热器和热界面材料。