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Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity
Small ( IF 13.0 ) Pub Date : 2018-02-02 , DOI: 10.1002/smll.201704044 Yimin Yao 1, 2 , Jiajia Sun 1, 3 , Xiaoliang Zeng 1 , Rong Sun 1 , Jian-Bin Xu 4 , Ching-Ping Wong 1, 4, 5
Small ( IF 13.0 ) Pub Date : 2018-02-02 , DOI: 10.1002/smll.201704044 Yimin Yao 1, 2 , Jiajia Sun 1, 3 , Xiaoliang Zeng 1 , Rong Sun 1 , Jian-Bin Xu 4 , Ching-Ping Wong 1, 4, 5
Affiliation
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Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through‐plane thermal conductivity of these polymer composites usually yields an undesired value (below 3.0 Wm−1 K−1). Here, construction of a 3D phonon skeleton is reported composed of stacked boron nitride (BN) platelets reinforced with reduced graphene oxide (rGO) for epoxy composites by the combination of ice‐templated and infiltrating methods. At a low filler loading of 13.16 vol%, the resulting 3D BN‐rGO/epoxy composites exhibit an ultrahigh through‐plane thermal conductivity of 5.05 Wm−1 K−1 as the best thermal‐conduction performance reported so far for BN sheet‐based composites. Theoretical models qualitatively demonstrate that this enhancement results from the formation of phonon‐matching 3D BN‐rGO networks, leading to high rates of phonon transport. The strong potential application for thermal management has been demonstrated by the surface temperature variations of the composites with time during heating and cooling.
中文翻译：
实现高导热率的聚合物复合材料3D骨架的构建
由于现代电子设备中越来越多的除热问题，在过去的十年中，具有高导热率的电绝缘聚合物复合材料备受关注。但是，传统的改善这些聚合物复合材料的平面热导率的方法通常会产生不希望的值（低于3.0 Wm -1 K -1）。在这里，报道了一种3D声子骨架的结构，该结构由叠层的氮化硼（BN）血小板组成，该薄片用还原的氧化石墨烯（rGO）增强，用于冰封模板和渗透方法的组合，用于环氧复合材料。在13.16 vol％的低填充量下，所得3D BN-rGO /环氧树脂复合材料具有5.05 Wm -1 K -1的超高通透热导率作为迄今为止报道的BN片材复合材料的最佳导热性能。理论模型定性地表明，这种增强是声子匹配的3D BN-rGO网络形成的结果，导致声子传输率很高。通过加热和冷却过程中复合材料的表面温度随时间变化，证明了热管理的强大潜力。
更新日期：2018-02-02
中文翻译：
实现高导热率的聚合物复合材料3D骨架的构建
由于现代电子设备中越来越多的除热问题，在过去的十年中，具有高导热率的电绝缘聚合物复合材料备受关注。但是，传统的改善这些聚合物复合材料的平面热导率的方法通常会产生不希望的值（低于3.0 Wm -1 K -1）。在这里，报道了一种3D声子骨架的结构，该结构由叠层的氮化硼（BN）血小板组成，该薄片用还原的氧化石墨烯（rGO）增强，用于冰封模板和渗透方法的组合，用于环氧复合材料。在13.16 vol％的低填充量下，所得3D BN-rGO /环氧树脂复合材料具有5.05 Wm -1 K -1的超高通透热导率作为迄今为止报道的BN片材复合材料的最佳导热性能。理论模型定性地表明，这种增强是声子匹配的3D BN-rGO网络形成的结果，导致声子传输率很高。通过加热和冷却过程中复合材料的表面温度随时间变化，证明了热管理的强大潜力。
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