Towards femtosecond laser ablation ionization mass spectrometric approaches for chemical depth-profiling analysis of lead-free Sn solder bumps with minimized side-wall contributions,Journal of Analytical Atomic Spectrometry

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Towards femtosecond laser ablation ionization mass spectrometric approaches for chemical depth-profiling analysis of lead-free Sn solder bumps with minimized side-wall contributions
Journal of Analytical Atomic Spectrometry ( IF 3.1 ) Pub Date : 2018-01-29 00:00:00 , DOI: 10.1039/c7ja00295e
A. Cedeño López _{1,

2,

3,

4,

5} , V. Grimaudo _{1,

2,

3,

4,

5} , P. Moreno-García _{1,

2,

3,

4,

5} , A. Riedo _{6,

7,

8,

9,

10} , M. Tulej _{3,

4,

5,

11,

12} , R. Wiesendanger _{3,

4,

5,

11,

12} , P. Wurz _{3,

4,

5,

11,

12} , P. Broekmann _{1,

2,

3,

4,

5}

Affiliation

Sn solder bumps on Cu pillars and the quantification of incorporated organic impurities are of urgent interest to the microchip industry. In this report, the fundamentals of laser–matter interaction using femtosecond laser ablation ionization mass spectrometry (fs-LIMS) are described, including studies on the ablation rate of a dual layer system Sn/Cu as well as on three different laser ablation approaches that (i) address the highly different material properties of Sn and Cu and (ii) allow for a significant reduction of side-wall contributions, which is a crucial prerequisite for chemical depth profiling.

中文翻译：

迈向飞秒激光烧蚀电离质谱方法，以最小化侧壁贡献来对无铅锡焊料凸块进行化学深度分析

铜柱上的锡焊料凸点和所掺入的有机杂质的定量是微芯片工业迫切关注的问题。在本报告中，描述了使用飞秒激光烧蚀电离质谱（fs-LIMS）进行激光与物质相互作用的基本原理，包括对双层系统Sn / Cu的烧蚀率以及三种不同的激光烧蚀方法的研究。（i）解决了Sn和Cu的材料特性差异很大的问题；（ii）大大减少了侧壁的影响，这是化学深度剖析的关键前提。

更新日期：2018-01-29

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