We report herein a fast optical inspection technique for the operation of large-area active-matrix (AM) backplanes by means of gate modulation (GM) imaging measurements. The technique is based on highly sensitive difference-image sensing between alternately biased gate-on and gate-off states for optical microscope images with many AM pixels. The use of a high-frame-rate complementary-metal-oxide-semiconductor image sensor and a high-speed image-subtraction module facilitates the bulk inspection of 30,000 pixels within 3 min, as is demonstrated using an all-printed and flexible AM backplane composed of one-transistor–one-capacitor cells arranged at a 150 pixel-per-inch resolution. We also demonstrate that the technique is very useful and effective not only in quickly identifying both defective transistors and capacitors by examining a zoomed-out image, but also in identifying the origin of defects within channel layers or capacitors by investigating an expanded image.

我们在这里报告通过门调制（GM）成像测量的大面积有源矩阵（AM）背板操作的快速光学检查技术。该技术基于具有许多AM像素的光学显微镜图像在交替偏置的栅极导通状态和栅极截止状态之间的高灵敏度差异图像感测。高帧速互补金属氧化物半导体图像传感器和高速图像减法模块的使用有助于在3分钟内对30,000个像素进行批量检查，如使用全印制和灵活的AM背板所证明的那样由以150像素/英寸分辨率排列的一个晶体管-一个电容器单元组成。